Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 15/20 | 0.76 |
| ▸ | ESR2 | Q92731 | 14/20 | 0.76 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.76 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.76 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | PGR | P06401 | 1/20 | 0.43 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.43 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.43 |
| ▸ | AR | P10275 | 1/20 | 0.43 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26946 | 0.87 | ESR1 (1.00) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL10593295 | 0.87 | ESR1 (1.00) | ESR1ESR2PDCD1CD274CYP1A2 | |
| Ammonia Solution, Strong SCHEMBL7989093 | 0.85 | ESR1 (0.94) | ESR1ESR2PDCD1CD274CYP1A2 | |
| Methane SCHEMBL21952131 | 0.85 | ESR1 (0.94) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL12230424 | 0.85 | ESR1 (0.67) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL3264497 | 0.80 | ESR1 (0.84) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL21632799 | 0.80 | ESR1 (0.84) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL15232906 | 0.80 | ESR1 (0.84) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL6563988 | 0.80 | ESR1 (0.84) | ESR1ESR2PDCD1CD274CYP1A2 | |
| SCHEMBL9808121 | 0.80 | ESR1 (0.84) | ESR1ESR2PDCD1CD274CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0528171-B1 | Composition containing a mixture of dicyanates and use thereof | IBM (US) | 1997-10-29 | — | — | EP | claimed |
| US-5668059-A | FILLING GAP WITH EPOXY BINDER, FILLER, CURING; NONCRACKING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1997-09-16 | — | — | US | claimed |
| US-5656862-A | GAP CREATED BY SOLDER CONNECTIONS FILLED WITH CURABLE CYCLOALIPHATIC POLYEPOXIDE OR CYANATE ESTER | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1997-08-12 | — | — | US | claimed |
| US-5623006-A | HAVING GAP FILLED WITH CURED POLYCYANURATE BINDER | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1997-04-22 | — | — | US | claimed |
| US-5536765-A | CYANATE TRIMERIZATION | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1996-07-16 | — | — | US | claimed |
| US-5471096-A | And filler of specified particle sizes, free of alpha particle emissions; cured binder; connections between integrated semiconductors and carrier substrate | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1995-11-28 | — | — | US | claimed |
| US-5468790-A | Useful in forming interconnection structures for integrated semiconductor devices | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1995-11-21 | — | — | US | claimed |
| EP-0653904-A2 | Via fill compositions for direct attach of devices and methods for applying same | International Business Machines Corporation (US) | 1995-05-17 | — | — | EP | claimed |
| EP-0604823-A1 | Triazine polymer and use thereof | International Business Machines Corporation (US) | 1994-07-06 | — | — | EP | claimed |
| US-5250848-A | Solder interconnection structure | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1993-10-05 | — | — | US | claimed |
| EP-0528171-A2 | Composition containing a mixture of dicyanates and use thereof | International Business Machines Corporation (US) | 1993-02-24 | — | — | EP | claimed |
| US-5089440-A | Solder interconnection structure and process for making | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1992-02-18 | — | — | US | claimed |
| EP-0446580-A1 | Solder interconnection structure with encapsulant and composition of the latter | International Business Machines Corporation (US) | 1991-09-18 | — | — | EP | claimed |
| US-4999699-A | Solder interconnection structure and process for making | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-03-12 | — | — | US | claimed |
| JP-5239180-A | — | — | None | — | — | JP | disclosed |
| EP-3344676-B1 | CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING | CARBON INC (US) | 2023-04-12 | — | — | EP | disclosed |
| US-11090859-B2 | Cyanate ester epoxy dual cure resins for additive manufacturing | CARBON, INC. (US) | 2021-08-17 | — | — | US | disclosed |
| EP-0446580-A1 | Solder interconnection structure with encapsulant and composition of the latter | International Business Machines Corporation (US) | 1991-09-18 | — | — | EP | disclosed |
| EP-0446666-A2 | Solder interconnection structure on organic substrates and process for making | International Business Machines Corporation (US) | 1991-09-18 | — | — | EP | disclosed |
| US-4999699-A | Solder interconnection structure and process for making | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1991-03-12 | — | — | US | disclosed |