SCHEMBL4073143

SCHEMBL4073143

Oc1cccnc1O.[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL103661 0.97
SCHEMBL29366238 0.97
Calcium SCHEMBL38655972 0.94
Hydrochloric Acid SCHEMBL5387641 0.94
SCHEMBL28236324 0.94
Hydrochloric Acid SCHEMBL5387644 0.94
Hydrochloric Acid SCHEMBL28532112 0.94 ALDH1A1 (0.50)
SCHEMBL28385351 0.94
Formaldehyde SCHEMBL27789023 0.90 L3MBTL1 (0.46)
SCHEMBL28388991 0.87 L3MBTL1 (0.45)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101489920-B Coating fluid, conductive thin film formed from coating fluid, and method of forming the same TOKAI RYOKAKU TETSUDO K K 2013-07-10 CN disclosed
US-8445118-B2 Coating liquid, metal compound film formed by coating liquid, and forming method thereof CENTRAL JAPAN RAILWAY COMPANY (JP) 2013-05-21 US disclosed
US-20090324963-A1 COATING LIQUID, METAL COMPOUND FILM FORMED BY COATING LIQUID, AND FORMING METHOD THEREOF CENTRAL JAPAN RAILWAY COMPANY (JP) 2009-12-31 US disclosed
CN-101489920-A Coating fluid, conductive thin film formed from coating fluid, and method of forming the same TOKAI RYOKAKU TETSUDO KK (JP) 2009-07-22 CN disclosed
EP-2048111-A1 COATING LIQUID, METAL COMPOUND THIN FILM FORMED BY USING COATING LIQUID, AND METHOD FOR FORMING THE SAME Central Japan Railway Company (JP) 2009-04-15 EP disclosed