Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | THRB | P10828 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9788138 | 0.89 | TSHR (0.53) | TSHRTHRBALDH1A1 | |
| SCHEMBL94906 | 0.87 | TSHR (0.68) | TSHRTHRBALDH1A1KDM4ETDP1 | |
| SCHEMBL19998240 | 0.85 | TSHR (0.65) | TSHRTHRBALDH1A1KDM4ETDP1 | |
| SCHEMBL22035404 | 0.84 | TSHR (0.45) | TSHRMAPK1THRBALDH1A1 | |
| SCHEMBL19999149 | 0.83 | TSHR (0.59) | TSHRTHRBALDH1A1TDP1 | |
| SCHEMBL12361090 | 0.82 | TSHR (0.46) | TSHRTHRBALDH1A1 | |
| SCHEMBL12361088 | 0.82 | TSHR (0.46) | TSHRTHRBALDH1A1 | |
| SCHEMBL10022219 | 0.82 | TSHR (0.53) | TSHRTHRBALDH1A1 | |
| SCHEMBL7079212 | 0.82 | TSHR (0.53) | TSHRTHRBALDH1A1KDM4E | |
| SCHEMBL9717921 | 0.81 | TSHR (0.49) | TSHRTHRBALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 131 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117555204-B | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-04-26 | — | — | CN | claimed |
| CN-117186403-B | Negative photosensitive resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-04-02 | — | — | CN | claimed |
| CN-117555204-A | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-02-13 | — | — | CN | claimed |
| CN-116836388-B | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-12-15 | — | — | CN | claimed |
| CN-117186403-A | Negative photosensitive resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-12-08 | — | — | CN | claimed |
| CN-116836388-A | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116577965-B | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116577965-A | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-116333303-B | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-08-04 | — | — | CN | claimed |
| CN-116333303-A | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-06-27 | — | — | CN | claimed |
| CN-115407610-B | Photosensitive resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | claimed |
| CN-115850596-A | Transparent photosensitive polyimide resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-28 | — | — | CN | claimed |
| CN-115437218-A | Photosensitive resin with symmetrical and asymmetrical structures and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-12-06 | — | — | CN | claimed |
| CN-115407610-A | Photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-29 | — | — | CN | claimed |
| CN-114995060-B | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-114995060-A | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | claimed |
| CN-114280887-A | Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof | 明士(北京)新材料开发有限公司 | 2022-04-05 | — | — | CN | claimed |
| CN-111522200-B | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2021-07-27 | — | — | CN | claimed |
| CN-111522200-A | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2020-08-11 | — | — | CN | claimed |
| CN-122085600-A | Negative photosensitive resin composition and preparation method and application thereof | — | 2026-05-26 | — | — | CN | disclosed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250251663-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-07 | — | — | US | disclosed |
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| CN-120129875-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2025-06-10 | — | — | CN | disclosed |
| WO-2025100302-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2025-05-15 | — | — | WO | disclosed |
| CN-119684161-A | Compound containing ureido structure, negative photosensitive resin composition, and preparation method and application thereof | 波米科技有限公司 | 2025-03-25 | — | — | CN | disclosed |
| CN-119596638-A | Negative photosensitive resin composition, preparation method and application | 波米科技有限公司 | 2025-03-11 | — | — | CN | disclosed |
| US-20250068074-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-02-27 | — | — | US | disclosed |
| CN-119350380-A | Nitrogen-containing heterocycle and siloxane structural compound, photosensitive resin composition, and preparation method and application thereof | 波米科技有限公司 | 2025-01-24 | — | — | CN | disclosed |
| CN-119213364-A | Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2024-12-27 | — | — | CN | disclosed |
| US-12174539-B2 | Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-12-24 | — | — | US | disclosed |
| WO-2024216630-A1 | PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | 深圳先进电子材料国际创新研究院 | 2024-10-24 | — | — | WO | disclosed |
| WO-2024198017-A1 | NEGATIVE PHOTOSENSITIVE POLYIMIDE PRECURSOR RESIN COMPOSITION | 深圳先进电子材料国际创新研究院 | 2024-10-03 | — | — | WO | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| WO-2024148707-A1 | POLYIMIDE PRECURSOR AND SYNTHETIC METHOD THEREFOR, AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING POLYIMIDE PRECURSOR | 深圳先进电子材料国际创新研究院 | 2024-07-18 | — | — | WO | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| CN-118244580-A | Photosensitive resin composition, cured film using same, method for producing same, and semiconductor device | 旭化成株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-118244583-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | disclosed |
| US-20240176240-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-05-30 | — | — | US | disclosed |
| WO-2024095927-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | 旭化成株式会社 | 2024-05-10 | — | — | WO | disclosed |
| WO-2024090486-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-05-02 | — | — | WO | disclosed |
| CN-117555204-B | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-117420732-B | Negative photosensitive resin composition and application thereof | 明士(北京)新材料开发有限公司 | 2024-04-16 | — | — | CN | disclosed |
| CN-117186403-B | Negative photosensitive resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-04-02 | — | — | CN | disclosed |
| US-20240101761-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-03-28 | — | — | US | disclosed |
| CN-116909100-B | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2024-03-19 | — | — | CN | disclosed |
| CN-117555204-A | Negative photosensitive polyimide glue solution and glue film suitable for flexible circuit board | 明士(北京)新材料开发有限公司 | 2024-02-13 | — | — | CN | disclosed |
| CN-114561009-B | Preparation method and application of negative photosensitive polyamide acid ester resin and composition thereof | 波米科技有限公司 | 2024-01-30 | — | — | CN | disclosed |
| CN-117420732-A | Negative photosensitive resin composition and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-19 | — | — | CN | disclosed |
| CN-116836388-B | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-12-15 | — | — | CN | disclosed |
| CN-117186403-A | Negative photosensitive resin, resin composition, and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-12-08 | — | — | CN | disclosed |
| US-11809079-B2 | Photosensitive resin composition, polyimide production method, and semiconductor device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-11-07 | — | — | US | disclosed |
| CN-116909100-A | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2023-10-20 | — | — | CN | disclosed |
| CN-116868124-A | Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2023-10-10 | — | — | CN | disclosed |
| CN-116836388-A | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-116577965-B | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-116802560-A | Photosensitive resin composition, method for producing polyimide cured film using same, and polyimide cured film | 旭化成株式会社 | 2023-09-22 | — | — | CN | disclosed |
| CN-116710498-A | Polyimide precursor resin composition and method for producing same | 旭化成株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-116577965-A | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-08-11 | — | — | CN | disclosed |
| CN-116333303-B | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-08-04 | — | — | CN | disclosed |
| CN-116482933-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2023-07-25 | — | — | CN | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-116333303-A | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-06-27 | — | — | CN | disclosed |
| CN-116239772-A | Polyimide precursor, synthesis method thereof and photosensitive resin composition containing polyimide precursor | 深圳先进电子材料国际创新研究院 | 2023-06-09 | — | — | CN | disclosed |
| CN-115407610-B | Photosensitive resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| US-20230110416-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-04-13 | — | — | US | disclosed |
| CN-115850596-A | Transparent photosensitive polyimide resin and preparation method and application thereof | 中国科学院化学研究所 | 2023-03-28 | — | — | CN | disclosed |
| CN-115755526-A | Photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115236938-B | Negative photosensitive polyamic acid ester resin composition and use thereof | 明士(北京)新材料开发有限公司 | 2023-01-10 | — | — | CN | disclosed |
| CN-115160569-B | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-12-27 | — | — | CN | disclosed |
| CN-115437218-A | Photosensitive resin with symmetrical and asymmetrical structures and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-12-06 | — | — | CN | disclosed |
| CN-115407610-A | Photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-29 | — | — | CN | disclosed |
| CN-114995060-B | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-01 | — | — | CN | disclosed |
| CN-115236938-A | Negative photosensitive polyamic acid ester resin composition and use thereof | 明士(北京)新材料开发有限公司 | 2022-10-25 | — | — | CN | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115160569-A | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-10-11 | — | — | CN | disclosed |
| US-20220291585-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-09-15 | — | — | US | disclosed |
| CN-115039029-A | Negative photosensitive resin composition and method for producing cured relief pattern | 旭化成株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114995060-A | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | disclosed |
| US-20220269170-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-08-25 | — | — | US | disclosed |
| WO-2022158359-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING POLYIMIDE CURED FILM WHICH USES SAME, AND POLYIMIDE CURED FILM | 旭化成株式会社 | 2022-07-28 | — | — | WO | disclosed |
| WO-2022158358-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | 旭化成株式会社 | 2022-07-28 | — | — | WO | disclosed |
| WO-2022154020-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2022-07-21 | — | — | WO | disclosed |
| EP-4006073-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | Asahi Kasei Kabushiki Kaisha (JP) | 2022-06-01 | — | — | EP | disclosed |
| CN-114561009-A | Negative photosensitive polyamic acid ester resin and preparation method and application of composition thereof | 波米科技有限公司 | 2022-05-31 | — | — | CN | disclosed |
| CN-114280887-A | Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof | 明士(北京)新材料开发有限公司 | 2022-04-05 | — | — | CN | disclosed |
| CN-114207522-A | Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-03-18 | — | — | CN | disclosed |
| US-20220011669-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2022-01-13 | — | — | US | disclosed |
| CN-113820920-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-12-21 | — | — | CN | disclosed |
| US-11163234-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2021-11-02 | — | — | US | disclosed |
| CN-107850844-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-09-07 | — | — | CN | disclosed |
| WO-2021153608-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | 旭化成株式会社 | 2021-08-05 | — | — | WO | disclosed |
| CN-111522200-B | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2021-07-27 | — | — | CN | disclosed |
| US-20210163650-A1 | POLYMER MATERIAL | MENICON CO., LTD. (JP) | 2021-06-03 | — | — | US | disclosed |
| CN-110941142-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2021-05-25 | — | — | CN | disclosed |
| EP-3822296-A1 | POLYMER MATERIAL | Menicon Co., Ltd. (JP) | 2021-05-19 | — | — | EP | disclosed |
| CN-112799281-A | Photosensitive resin composition, method for producing polyimide, and semiconductor device | 旭化成株式会社 | 2021-05-14 | — | — | CN | disclosed |
| CN-112334833-A | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2021-02-05 | — | — | CN | disclosed |
| WO-2021020463-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2021-02-04 | — | — | WO | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| CN-107615166-B | Photosensitive resin composition, method for producing polyimide, and semiconductor device | 旭化成株式会社 | 2020-12-25 | — | — | CN | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20200301273-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-09-24 | — | — | US | disclosed |
| CN-111522200-A | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2020-08-11 | — | — | CN | disclosed |
| US-10719016-B2 | Photosensitive resin composition, polyimide production method, and semiconductor device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-07-21 | — | — | US | disclosed |
| CN-110941142-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2020-03-31 | — | — | CN | disclosed |
| WO-2020026840-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | 旭化成株式会社 | 2020-02-06 | — | — | WO | disclosed |
| CN-106104381-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2019-12-13 | — | — | CN | disclosed |
| US-10354932-B2 | Semiconductor device including semiconductor element and redistribution layer electrically connected thereto, and method of manufacturing the device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-07-16 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20190072850-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-03-07 | — | — | US | disclosed |
| US-20180373147-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-12-27 | — | — | US | disclosed |
| US-20180342432-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-11-29 | — | — | US | disclosed |
| US-8742005-B2 | Acrylate-based compounds and photosensitive composition comprising the same | LG CHEM, LTD. (KR) | 2014-06-03 | — | — | US | disclosed |
| US-20120156619-A1 | ACRYLATE-BASED COMPOUNDS AND PHOTOSENSITIVE COMPOSITION COMPRISING THE SAME | LG CHEM, LTD. (KR) | 2012-06-21 | — | — | US | disclosed |
| CN-1668980-B | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2010-05-12 | — | — | CN | disclosed |
| US-20100047185-A1 | ACTVIE SUBSTANCE COMBINATION | ISDIN S.A. (ES) | 2010-02-25 | — | — | US | disclosed |
| US-7563557-B2 | Polyamide | ASAHI KASEI EMD CORPORATION (JP) | 2009-07-21 | — | — | US | disclosed |
| US-20080193398-A1 | Derivatives of Heptaazaphenalene, Methods for Obtaining Them, and Their Use as Protecting Agents Against Uv Radiation | ISDIN, S.A. (ES) | 2008-08-14 | — | — | US | disclosed |
| US-20070248910-A1 | heat resistant; low residual stress after curing; electronic insulation; semiconductor; a phthalic acid having an amine or imide group and an aromatic tetracarboxylic acid and a diamino siloxane or polysiloxane; tetracarboxybiphenyl; 5-aminoisophthalic acid; cured relief pattern; polyamide-imide precurso | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-25 | — | — | US | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| EP-1775316-A1 | POLYAMIDE | Asahi Kasei EMD Corporation (JP) | 2007-04-18 | — | — | EP | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| CN-1668980-A | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI CHEMICAL CORP (JP) | 2005-09-14 | — | — | CN | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | TSHR 3312/4885MAPK1 2987/4885THRB 3525/4885 |
| US-20080193398-A1 | Derivatives of Heptaazaphenalene, Methods for Obtaining Them, and Their Use as Protecting Agents Against Uv Radiation | ERCC4, XPA, CYP51A1 | TSHR 4144/4885MAPK1 4184/4885THRB 3985/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | TSHR 2388/4885MAPK1 1924/4885THRB 1053/4885 |
| US-20100047185-A1 | ACTVIE SUBSTANCE COMBINATION | UGT2B17, TACR2, UGT1A1 | TSHR 2328/4885MAPK1 4141/4885THRB 1148/4885 |
| US-20120156619-A1 | ACRYLATE-BASED COMPOUNDS AND PHOTOSENSITIVE COMPOSITION COMPRISING THE SAME | TYR, PAH, ACR | TSHR 4719/4885MAPK1 2621/4885THRB 4734/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.