SCHEMBL4077778

SCHEMBL4077778

CC(P(=O)(c1ccccc1)c1ccccc1)P(=O)(c1ccccc1)c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.52
L3MBTL1 Q9Y468 2/20 0.52
CA2 P00918 1/20 0.46
CA4 P22748 1/20 0.46
CA5A P35218 1/20 0.46
HTT P42858 1/20 0.46
RECQL P46063 1/20 0.46
NPSR1 Q6W5P4 1/20 0.45
HSD17B10 Q99714 2/20 0.44
KDM4E B2RXH2 2/20 0.44
ESR1 P03372 1/20 0.43
KCNN4 O15554 2/20 0.42
KCNA5 P22460 2/20 0.42
POLB P06746 1/20 0.42
NPC1 O15118 1/20 0.41
ADAM17 P78536 1/20 0.41
GAA P10253 1/20 0.41
CFTR P13569 1/20 0.41
TSHR P16473 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5188115 0.89 HPGD (0.52) ALDH1A1L3MBTL1HTTRECQLNPSR1
SCHEMBL12585369 0.84 ALDH1A1 (0.52) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL1726911 0.84 ALDH1A1 (0.52) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL7898050 0.84 ALDH1A1 (0.52) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL7382479 0.82 ALDH1A1 (0.50) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL8369385 0.80 L3MBTL1 (0.48) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL1461101 0.80 L3MBTL1 (0.48) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL4811793 0.80 L3MBTL1 (0.53) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL4811778 0.80 L3MBTL1 (0.53) ALDH1A1L3MBTL1CA2CA4CA5A
SCHEMBL29267192 0.80 L3MBTL1 (0.52) ALDH1A1L3MBTL1CA2CA4CA5A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3296338-B1 POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND CURED RESIN MITSUI CHEMICALS INC (JP) 2020-04-01 EP disclosed
US-10011677-B2 Polycarbodiimide composition, method for producing polycarbodiimide composition, aqueous dispersion composition, solution composition, resin composition, and cured resin MITSUI CHEMICALS, INC. (JP) 2018-07-03 US disclosed
US-20180148533-A1 POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND CURED RESIN MITSUI CHEMICALS, INC. (JP) 2018-05-31 US disclosed
EP-3296338-A1 POLYCARBODIIMIDE COMPOSITION, METHOD FOR PRODUCING POLYCARBODIIMIDE COMPOSITION, AQUEOUS DISPERSION COMPOSITION, SOLUTION COMPOSITION, RESIN COMPOSITION, AND RESIN CURED PRODUCT Mitsui Chemicals, Inc. (JP) 2018-03-21 EP disclosed
US-7608391-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2009-10-27 US disclosed
EP-1445269-B1 Polycarbodiimide having high index of refraction and production method thereof NITTO DENKO CORP (JP) 2009-03-18 EP disclosed
US-7465533-B2 Photothermographic material and an image forming method FUJIFILM CORPORPORATION (JP) 2008-12-16 US disclosed
US-7462444-B2 Image forming method for the photothermographic material FUJIFILM CORPORATION (JP) 2008-12-09 US disclosed
EP-1635216-B1 Photothermographic material FUJIFILM CORP (JP) 2008-11-05 EP disclosed
EP-1637925-B1 Photothermographic material FUJIFILM CORP (JP) 2008-11-05 EP disclosed
EP-1555862-A2 Process for producing circuit board having built-in electronic part NITTO DENKO CORPORATION (JP) 2005-07-20 EP disclosed
EP-1512706-A2 Thermosetting resin NITTO DENKO CORPORATION (JP) 2005-03-09 EP disclosed
US-20050049385-A1 Thermosetting resin NITTO DENKO CORPORATION 2005-03-03 US disclosed
US-6846550-B2 Heat resistant sealing resin between wire circuit and semiconductor NITTO DENKO CORPORATION (JP) 2005-01-25 US disclosed
US-20040178423-A1 Adhesive film for underfill and semiconductor device using the same NITTO DENKO CORPORATION 2004-09-16 US disclosed
US-20040158021-A1 Polycarbodiimide having high index of refraction and production method thereof NITTO DENKO CORPORATION 2004-08-12 US disclosed
EP-1445269-A1 Polycarbodiimide having high index of refraction and production method thereof NITTO DENKO CORPORATION (JP) 2004-08-11 EP disclosed
US-20040096633-A1 Heat resistant sealing resin between wire circuit and semiconductor NITTO DENKO CORPORATION 2004-05-20 US disclosed
EP-1080084-A2 PROCESS FOR EPOXIDATION OF ARYL ALLYL ETHERS THE DOW CHEMICAL COMPANY (US) 2001-03-07 EP disclosed
WO-1999062894-A2 PROCESS FOR EPOXIDATION OF ARYL ALLYL ETHERS THE DOW CHEMICAL COMPANY (US) 1999-12-09 WO disclosed