⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL10801236 | 0.97 | THRB (0.42) | — | |
| Piperazine SCHEMBL28971410 | 0.84 | THRB (0.33) | — | |
| SCHEMBL3420600 | 0.84 | THRB (0.33) | — | |
| Morpholine SCHEMBL28971412 | 0.76 | MEN1 (0.41) | — | |
| Thiomorpholine SCHEMBL28971399 | 0.76 | — | — | |
| SCHEMBL2931933 | 0.76 | THRB (0.47) | — | |
| SCHEMBL4083701 | 0.75 | — | — | |
| SCHEMBL4092993 | 0.71 | ADRB2 (0.38) | — | |
| SCHEMBL9068994 | 0.71 | — | — | |
| SCHEMBL2050944 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 108 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12062613-B2 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-08-13 | — | — | US | claimed |
| CN-115678018-B | Polyurethane-organic silicon resin prepolymer and preparation method and application thereof | 海洋化工研究院有限公司 | 2023-10-20 | — | — | CN | claimed |
| US-20220359412-A1 | SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2022-11-10 | — | — | US | claimed |
| US-11417602-B2 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2022-08-16 | — | — | US | claimed |
| CN-108735712-B | Method for forming ultra-low dielectric constant inter-metal dielectric layer | 台湾积体电路制造股份有限公司 | 2021-07-27 | — | — | CN | claimed |
| CN-109880104-B | Preparation method of phosphorus-based organic silicon type flame retardant | 普信氟硅新材料（衢州）有限公司 | 2021-05-28 | — | — | CN | claimed |
| US-20200335449-A1 | SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2020-10-22 | — | — | US | claimed |
| US-10707165-B2 | Semiconductor device having an extra low-k dielectric layer and method of forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2020-07-07 | — | — | US | claimed |
| CN-109880104-A | A kind of preparation method of phosphorus system organic silicon type fire retardant | 普信氟硅新材料（衢州）有限公司 | 2019-06-14 | — | — | CN | claimed |
| US-20180308801-A1 | SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND METHOD OF FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2018-10-25 | — | — | US | claimed |
| CN-105401131-A | Method And Composition For Providing Pore Sealing Layer On Porous Low Dielectric Constant Films | AIR PROD & CHEM | 2016-03-16 | — | — | CN | claimed |
| CN-101775140-A | Class of super heat-resistant imide aromatic heterocyclic modified silane coupling agent | UNIV NANCHANG | 2010-07-14 | — | — | CN | claimed |
| US-20260101742-A1 | STACKING VIA CONFIGURATION FOR ADVANCED SILICON NODE PRODUCTS AND METHODS FOR FORMING THE SAME | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2026-04-09 | — | — | US | disclosed |
| EP-4703405-A1 | CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME | Kaneka Corporation (JP) | 2026-03-04 | — | — | EP | disclosed |
| US-20260049203-A1 | CURABLE COMPOSITION | KANEKA NORTH AMERICA LLC (US) | 2026-02-19 | — | — | US | disclosed |
| US-12519055-B2 | Stacking via configuration for advanced silicon node products and methods for forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TW) | 2026-01-06 | — | — | US | disclosed |
| CN-1831193-A | Plating method | ROHM & HAAS ELECT MAT (US) | 2006-09-13 | — | — | CN | disclosed |
| CN-1775861-A | Composition and method | ROHM & HAAS ELECT MAT (US) | 2006-05-24 | — | — | CN | disclosed |
| CN-1227311-C | Coating composition for the production of insulating thin films | ASAHI CHEMICAL IND (JP) | 2005-11-16 | — | — | CN | disclosed |
| CN-1422310-A | Coating composition for the production of insulating thin films | ASAHI CHEMICAL IND (JP) | 2003-06-04 | — | — | CN | disclosed |