SCHEMBL4103204

SCHEMBL4103204

CCC1C=C(C)CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22107492 0.83 NOS3 (0.36)
SCHEMBL6538724 0.80
SCHEMBL22878897 0.79 CYP1A2 (0.38)
SCHEMBL6337506 0.77 OPRM1 (0.30)
SCHEMBL28082972 0.76
SCHEMBL18566770 0.76
SCHEMBL7595434 0.76 NOS3 (0.31)
SCHEMBL13011069 0.76
SCHEMBL16691803 0.75
SCHEMBL31410609 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250183478-A1 POLYAMIDE-IMIDE RESIN, POLYAMIDE-IMIDE FIBER, NONWOVEN FABRIC, AND SEPARATOR FOR ELECTRONIC COMPONENT TOYOBO MC CORPORATION (JP) 2025-06-05 US disclosed
WO-2024262187-A1 RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM 東洋紡株式会社 2024-12-26 WO disclosed
EP-4480980-A1 POLYAMIDIMIDE RESIN, POLYAMIDIMIDE FIBERS, NON-WOVEN FABRIC AND ELECTRONIC COMPONENT SEPARATOR TOYOBO MC Corporation (JP) 2024-12-25 EP disclosed
US-20240395547-A1 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS UNIVERSITY OF TSUKUBA (JP) 2024-11-28 US disclosed
CN-118679203-A Polyamide-imide resin, polyamide-imide fiber, nonwoven fabric, and separator for electronic component 东洋纺艾睦希株式会社 2024-09-20 CN disclosed
WO-2024171912-A1 LOW LINEAR EXPANSION SYNDIOTACTIC POLYSTYRENE LAMINATE 東洋紡株式会社 2024-08-22 WO disclosed
EP-4401112-A1 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS University of Tsukuba (JP) 2024-07-17 EP disclosed
CN-117916856-A Semiconductor device and method for manufacturing semiconductor device 国立大学法人筑波大学 2024-04-19 CN disclosed
CN-117500895-A Adhesive composition, adhesive sheet, electromagnetic wave shielding material, laminate, and printed wiring board 东洋纺MC株式会社 2024-02-02 CN disclosed
CN-113286835-B Adhesive composition containing dimeric alcohol copolymerized polyimide polyurethane resin 东洋纺MC株式会社 2023-09-29 CN disclosed
US-20180298284-A1 COMPOSITION FOR LIQUID CRYSTAL ALIGNMENT AGENT, MANUFACTURING METHOD OF LIQUID CRYSTAL ALIGNMENT FILM, LIQUID CRYSTAL ALIGNMENT FILM USING THE SAME AND LIQUID CRYSTAL DISPLAY DEVICE LG CHEM, LTD. (KR) 2018-10-18 US disclosed
EP-3382450-A1 CLEANING AGENT COMPOSITION FOR LIQUID CRYSTAL ALIGNMENT FILM AND METHOD FOR PREPARING LIQUID CRYSTAL ALIGNMENT FILM USING SAME LG Chem, Ltd. (KR) 2018-10-03 EP disclosed
CN-108474983-A Cleaning composition for liquid crystal alignment layer and method for manufacturing liquid crystal alignment layer using same 株式会社LG化学 2018-08-31 CN disclosed
CN-108291149-A Liquid crystal alignment composition, method for preparing liquid crystal alignment film using the same, and liquid crystal alignment film using the same 株式会社LG化学 2018-07-17 CN disclosed
CN-108138051-A Composition for liquid crystal aligning agent, method for producing liquid crystal alignment film, liquid crystal alignment film using same, and liquid crystal display device 株式会社LG化学 2018-06-08 CN disclosed
EP-3315544-A1 LIQUID CRYSTAL ALIGNMENT FILM MANUFACTURING METHOD, AND LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT, USING SAME LG Chem, Ltd. (KR) 2018-05-02 EP disclosed
CN-107922647-A Method of manufacturing liquid crystal alignment layer, liquid crystal alignment layer manufactured by using the same, and liquid crystal display device 株式会社LG化学 2018-04-17 CN disclosed
CN-107075116-A Polymers for liquid crystal aligning agents 株式会社LG化学 2017-08-18 CN disclosed
EP-3196228-A1 POLYMER FOR LIQUID CRYSTAL ALIGNMENT AGENT LG Chem, Ltd. (KR) 2017-07-26 EP disclosed
US-20090221777-A1 PHOTOSENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-09-03 US disclosed