Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APEX1 | P27695 | 1/20 | 0.54 |
| ▸ | FABP4 | P15090 | 2/20 | 0.52 |
| ▸ | FABP5 | Q01469 | 2/20 | 0.52 |
| ▸ | LMNA | P02545 | 2/20 | 0.48 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.46 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 4/20 | 0.45 |
| ▸ | PTGS2 | P35354 | 4/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.45 |
| ▸ | CAMK2A | Q9UQM7 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25465028 | 0.93 | PTGS1 (0.53) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL30976974 | 0.91 | APEX1 (0.47) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL25465029 | 0.91 | PTGS1 (0.57) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL3771053 | 0.87 | FABP4 (0.46) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL6520401 | 0.85 | APEX1 (0.78) | APEX1FABP4FABP5PTGS1PTGS2 | |
| SCHEMBL17331142 | 0.84 | NPSR1 (0.50) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL24703577 | 0.84 | TSHR (0.62) | APEX1FABP4FABP5TSHR | |
| SCHEMBL113643 | 0.84 | APEX1 (0.71) | APEX1FABP4FABP5LMNASMN1; SMN2 | |
| SCHEMBL11513833 | 0.82 | CSNK2A2 (0.54) | APEX1FABP4FABP5LMNASLC22A6 | |
| SCHEMBL11712403 | 0.82 | FABP4 (0.54) | APEX1FABP4FABP5LMNATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4063061-B1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2024-04-24 | — | — | EP | claimed |
| EP-3650164-B1 | FLUX AND SOLDERING MATERIAL | KOKI KK (JP) | 2022-11-02 | — | — | EP | claimed |
| CN-109429491-B | Flux and solder material | 株式会社弘辉 | 2021-07-27 | — | — | CN | claimed |
| US-10864606-B2 | Flux and solder material | KOKI COMPANY LIMITED (JP) | 2020-12-15 | — | — | US | claimed |
| US-20200269362-A1 | Flux and Solder Material | KOKI COMPANY LIMITED (JP) | 2020-08-27 | — | — | US | claimed |
| EP-3650164-A1 | FLUX AND SOLDERING MATERIAL | Koki Company Limited (JP) | 2020-05-13 | — | — | EP | claimed |
| US-12194573-B2 | Solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2025-01-14 | — | — | US | disclosed |
| CN-118103472-A | Adhesive, laminate, and packaging material | DIC株式会社 | 2024-05-28 | — | — | CN | disclosed |
| EP-4019566-B1 | EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRICAL OR ELECTRONIC COMPONENT | MITSUBISHI CHEM CORP (JP) | 2024-05-01 | — | — | EP | disclosed |
| EP-4063060-B1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2024-04-24 | — | — | EP | disclosed |
| EP-4063061-B1 | FLUX AND SOLDER PASTE | SENJU METAL INDUSTRY CO (JP) | 2024-04-24 | — | — | EP | disclosed |
| US-20240024991-A1 | Solder Material and Solder Material Production Method | KOKI COMPANY LIMITED (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20240001492-A1 | Flux | KOKI COMPANY LIMITED (JP) | 2024-01-04 | — | — | US | disclosed |
| JP-2005171119-A | THERMOSETTING RESIN COMPOSITION AND LIGHT-EMITTING DIODE COMPRISING THE SAME AS SEALING AGENT | STANLEY ELECTRIC CO LTD | 2005-06-30 | — | — | JP | disclosed |
| EP-1522554-A1 | Polyacetal resin composition and shaped article thereof | Polyplastics Co., Ltd. (JP) | 2005-04-13 | — | — | EP | disclosed |
| US-20050064336-A1 | Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereof | TAIYO INK MANUFACTURING CO., LTD. (JP) | 2005-03-24 | — | — | US | disclosed |
| US-6841305-B2 | High temperature, storage stability | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-01-11 | — | — | US | disclosed |
| US-20020009652-A1 | High temperature, storage stability | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2002-01-24 | — | — | US | disclosed |
| EP-1160899-A2 | Non-aqueous electrolyte battery and non-aqueous electrolyte | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2001-12-05 | — | — | EP | disclosed |
| JP-2001011057-A | NOVEL CARBOXYLIC ACID BEARING ISOCYANURIC ACID RING AND ITS PRODUCTION AND RESIN COMPOSITION CONTAINING THE SAME | SHIKOKU CHEM CORP | 2001-01-16 | — | — | JP | disclosed |