Benzil

Benzil

SCHEMBL4125953

NC(N)=O.O=C(C(=O)c1ccccc1)c1ccccc1

nearest known ligand 0.82

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 12/20 0.82
CES1 P23141 11/20 0.82
L3MBTL1 Q9Y468 2/20 0.65
TSHR P16473 2/20 0.65
POLB P06746 1/20 0.65
CYP3A4 P08684 1/20 0.65
PARP1 P09874 1/20 0.65
MAPT P10636 1/20 0.65
CYP2C19 P33261 1/20 0.65
RECQL P46063 1/20 0.65
BLM P54132 1/20 0.65
PMP22 Q01453 1/20 0.65
HSD17B10 Q99714 1/20 0.65
TDP1 Q9NUW8 1/20 0.65
ALDH1A1 P00352 2/20 0.55
KDM4E B2RXH2 1/20 0.55
GAA P10253 1/20 0.55
DAO P14920 1/20 0.55
NAPRT Q6XQN6 1/20 0.55
RAB9A P51151 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzil SCHEMBL10610529 0.94 CES2 (0.82) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL2234045 0.91 CES2 (0.88) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL7142843 0.91 CES2 (1.00) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL2156589 0.91 CES2 (1.00) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL28475956 0.91 CES2 (1.00) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL9517636 0.91 CES2 (1.00) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL66 0.91 CES2 (1.00) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL11415302 0.89 CES2 (0.74) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL27757984 0.88 CES2 (0.82) CES2CES1L3MBTL1TSHRPOLB
Benzil SCHEMBL4957522 0.88 CES2 (1.00) CES2CES1TSHRALDH1A1DAO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104710491-A Preparation method for (2'R)-2'-deoxy-2'-fluoro-2'-methyluridine NINGBO CHEMGOO PHARMACEUTICAL TECHNOLOGY INNOVATION LTD 2015-06-17 CN claimed
CN-122080093-A Compounds effective in treating liver toxicity and fatty liver disease and uses thereof 2026-05-26 CN disclosed
US-12460043-B2 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material THE YOKOHAMA RUBBER CO., LTD. (JP) 2025-11-04 US disclosed
EP-4282902-B1 RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI GAS CHEMICAL CO (JP) 2025-07-02 EP disclosed
CN-119365518-A Resin composition, cured product, sealing material, adhesive, insulating material, coating material, prepreg, multilayer body, and fiber-reinforced composite material 三菱瓦斯化学株式会社 2025-01-24 CN disclosed
CN-117859183-A Conductive adhesive composition for bonding solar cells 汉高股份有限及两合公司 2024-04-09 CN disclosed
CN-117377731-A Curable composition and use thereof 汉高股份有限及两合公司 2024-01-09 CN disclosed
US-20230383047-A1 RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-30 US disclosed
WO-2023228509-A1 RESIN COMPOSITION, CURED SUBSTANCE, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYER BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL 三菱瓦斯化学株式会社 2023-11-30 WO disclosed
EP-4282902-A1 RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-29 EP disclosed
CN-107431025-A Heat-setting encapsulant composition and application thereof 汉高股份有限及两合公司 2017-12-01 CN disclosed
US-9129566-B2 Image displaying medium, image display device, writing device and displaying method FUJI XEROX CO., LTD. (JP) 2015-09-08 US disclosed
CN-104710491-A Preparation method for (2'R)-2'-deoxy-2'-fluoro-2'-methyluridine NINGBO CHEMGOO PHARMACEUTICAL TECHNOLOGY INNOVATION LTD 2015-06-17 CN disclosed
CN-103228696-A One component epoxy resin composition HENKEL CORP 2013-07-31 CN disclosed
CN-101553545-B Bonding method and adhesive resin composition HENKEL CORP 2012-07-18 CN disclosed
CN-101553545-A Bonding method and adhesive resin composition HENKEL CORP (US) 2009-10-07 CN disclosed
US-20090046053-A1 IMAGE DISPLAYING MEDIUM AND IMAGE DISPLAY DEVICE FUJI XEROX CO., LTD. (JP) 2009-02-19 US disclosed
US-20080036731-A1 Image displaying medium, image display device, writing device and displaying method FUJI XEROX CO., LTD. (JP) 2008-02-14 US disclosed
US-6180250-B1 EPOXY RESIN OBTAINED BY GLYCIDYL ETHERIFYING A CONDENSATION PRODUCT OF A PHENOL AND HYDROXYBENZALDEHYDE; CONDENSATION PRODUCT OF BISPHENOL A AND FORMALDEHYDE; AND A UREA DERIVATIVE. HITACHI CHEMICAL CO., LTD. (JP) 2001-01-30 US disclosed
EP-0870805-A2 Epoxy composition for printed circuit boards Hitachi Chemical Co., Ltd. (JP) 1998-10-14 EP disclosed