Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.71 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.49 |
| ▸ | TSHR | P16473 | 5/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28440289 | 0.94 | ALDH1A1 (0.63) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| SCHEMBL6383674 | 0.92 | ALDH1A1 (0.85) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| SCHEMBL28545137 | 0.87 | LMNA (0.58) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| SCHEMBL28551084 | 0.87 | LMNA (0.58) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| Octyldodecanol SCHEMBL28561179 | 0.87 | LMNA (0.58) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| SCHEMBL14891221 | 0.86 | ALDH1A1 (0.54) | ALDH1A1SMN1; SMN2TDP1TSHRCYP3A4 | |
| Alcohol SCHEMBL8471007 | 0.86 | ALDH1A1 (0.91) | ALDH1A1SMN1; SMN2TDP1TSHRCYP3A4 | |
| Glycerin SCHEMBL28089686 | 0.84 | ALDH1A1 (0.81) | ALDH1A1SMN1; SMN2TDP1TSHRLMNA | |
| SCHEMBL12977820 | 0.83 | ALDH1A1 (1.00) | ALDH1A1SMN1; SMN2TDP1TSHRCYP3A4 | |
| SCHEMBL12977802 | 0.83 | ALDH1A1 (1.00) | ALDH1A1SMN1; SMN2TDP1TSHRCYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 165 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11198754-B2 | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator | SIKA TECHNOLOGY AG (CH) | 2021-12-14 | — | — | US | claimed |
| CN-103897145-A | Hydrophobic epoxy resin curing agent and preparation method thereof | HUNAN KOSEN NEW MATERIAL CO LTD | 2014-07-02 | — | — | CN | claimed |
| EP-4399254-A1 | EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION | Sika Technology AG (CH) | 2024-07-17 | — | — | EP | disclosed |
| WO-2024113146-A1 | MOISTURE AND HEAT-CURABLE SEALING COMPOSITION | SIKA TECHNOLOGY AG (CH) | 2024-06-06 | — | — | WO | disclosed |
| CN-118119659-A | Flame-retardant epoxy resin composition | SIKA技术股份公司 | 2024-05-31 | — | — | CN | disclosed |
| CN-118019772-A | Cracking-resistant two-component epoxy resin composition | SIKA技术股份公司 | 2024-05-10 | — | — | CN | disclosed |
| WO-2024092601-A1 | TWO-COMPONENT EPOXY ADHESIVE FOR LIQUIFIED NATURAL GAS CONTAINERS | SIKA TECHNOLOGY AG (CH) | 2024-05-10 | — | — | WO | disclosed |
| US-11932786-B2 | Method for structurally joining substrates having different coefficients of linear thermal expansion | SIKA TECHNOLOGY AG (CH) | 2024-03-19 | — | — | US | disclosed |
| CN-117715997-A | Expandable one-component thermosetting epoxy adhesives with improved adhesion | SIKA技术股份公司 | 2024-03-15 | — | — | CN | disclosed |
| WO-2024052276-A1 | CURABLE POLYMER COMPOSITION HAVING IMPROVED WASH-OFF RESISTANCE | ZEPHYROS, INC. (US) | 2024-03-14 | — | — | WO | disclosed |
| EP-3652047-B1 | SINGLE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH HIGH WASHING RESISTANCE | SIKA TECH AG (CH) | 2024-03-13 | — | — | EP | disclosed |
| CN-101646706-A | Epoxy group-terminated polymkeric substance, its composition and as the purposes of impact resistance modifiers | SIKA TECHNOLOGY AG CH | 2010-02-10 | — | — | CN | disclosed |
| US-20100009196-A1 | Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer | SIKA TECHNOLOGY AG (CH) | 2010-01-14 | — | — | US | disclosed |
| CN-101605859-A | Edging-fold bond | SIKA TECHNOLOGY AG (CH) | 2009-12-16 | — | — | CN | disclosed |
| US-20090288766-A1 | Heat-curable epoxy resin composition containing one blocked and one epoxide-terminated polyurethane prepolymer | SIKA TECHNOLOGY AG (CH) | 2009-11-26 | — | — | US | disclosed |
| US-20090264558-A1 | Capped polyurethane prepolymers and heat-curable epoxy resin compositions | SIKA TECHNOLOGY AG (CH) | 2009-10-22 | — | — | US | disclosed |
| CN-101528802-A | Heat-curing epoxy resin compositions comprising blocked and epoxide-terminated polyurethane prepolymers | SIKA TECHNOLOGY AG (CH) | 2009-09-09 | — | — | CN | disclosed |
| CN-101528799-A | Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer | SIKA TECHNOLOGY AG (CH) | 2009-09-09 | — | — | CN | disclosed |
| CN-101528797-A | Derivatized solid epoxy resins and uses thereof | SIKA TECHNOLOGY AG (CH) | 2009-09-09 | — | — | CN | disclosed |
| CN-101528796-A | Blocked polyurethane prepolymer and heat-curable epoxy resin composition | SIKA TECHNOLOGY AG (CH) | 2009-09-09 | — | — | CN | disclosed |