Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL4160630

N.O=C(OF)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)F

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
KDM4E B2RXH2 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
USP2 O75604 1/20 0.35
MAPT P10636 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
HTT P42858 1/20 0.35
GAA P10253 1/20 0.32
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL6997853 1.00 TSHR (0.38) TSHRKDM4ETDP1USP2MAPT
SCHEMBL720226 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL715364 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL714357 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL713217 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL715943 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL713038 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL716379 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL403954 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT
SCHEMBL712408 0.98 TSHR (0.39) TSHRKDM4ETDP1USP2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117625171-B Quartz sand propping agent for fracturing and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-29 CN claimed
CN-117603674-B Ceramsite sand fracturing propping agent and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-22 CN claimed
CN-117625171-A Quartz sand propping agent for fracturing and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-01 CN claimed
CN-117603674-A Ceramsite sand fracturing propping agent and preparation method thereof 胜利油田方圆陶业有限公司 2024-02-27 CN claimed
US-20090042390-A1 ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME SUMCO CORPORATION (JP) 2009-02-12 US claimed
CN-119798968-A Composite material with heat conduction function and preparation method and application thereof 领固新材料(广东)有限公司 2025-04-11 CN disclosed
CN-115926353-B Physical expansion foaming microsphere and preparation method thereof 浙江工业大学 2025-04-08 CN disclosed
CN-118652676-B Propping agent and preparation method thereof 铜川恒晟科技材料有限公司 2024-11-15 CN disclosed
CN-118652676-A Propping agent and preparation method thereof 铜川恒晟科技材料有限公司 2024-09-17 CN disclosed
CN-117625171-B Quartz sand propping agent for fracturing and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-29 CN disclosed
CN-117625171-B Quartz sand propping agent for fracturing and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-29 CN disclosed
CN-117603674-B Ceramsite sand fracturing propping agent and preparation method thereof 胜利油田方圆陶业有限公司 2024-03-22 CN disclosed
US-20120214148-A1 POLYFLUOROALKYLPHOSPHONIC ACID SALT EMULSIFIER AND MOLD-RELEASING AGENT COMPRISING THE SAME AS ACTIVE INGREDIENT UNIMATEC CO., LTD. (JP) 2012-08-23 US disclosed
EP-2479216-A1 EMULSION AND MOLD RELEASE AGENT COMPRISING THE EMULSION Unimatec Co., Ltd. (JP) 2012-07-25 EP disclosed
US-20120178075-A1 EMULSION AND MOLD-RELEASING AGENT USING THE SAME UNIMATEC CO., LTD. (JP) 2012-07-12 US disclosed
US-20090042390-A1 ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANUFACTURING SILICON WAFERS USING THE SAME SUMCO CORPORATION (JP) 2009-02-12 US disclosed
EP-1678340-A4 SURFACE REACTIVE PRESERVATIVE FOR USE WITH SOLDER PREFORMS KESTER INC (US) 2008-07-23 EP disclosed
EP-1678340-A2 SURFACE REACTIVE PRESERVATIVE FOR USE WITH SOLDER PREFORMS KAC Holdings, Inc. (US) 2006-07-12 EP disclosed
WO-2005038070-A2 SURFACE REACTIVE PRESERVATIVE FOR USE WITH SOLDER PREFORMS KAC HOLDINGS, INC. (US) 2005-04-28 WO disclosed
US-20050077502-A1 Surface reactive preservative for use with solder preforms KESTER, INC. 2005-04-14 US disclosed