Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | USP2 | O75604 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | ABCC4 | O15439 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4958552 | 0.85 | TSHR (0.38) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL3878685 | 0.84 | TSHR (0.33) | TSHRALDH1A1 | |
| SCHEMBL4960214 | 0.77 | TSHR (0.38) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL153874 | 0.75 | TSHR (0.37) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL4958703 | 0.75 | TSHR (0.37) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL11063317 | 0.75 | — | — | |
| SCHEMBL8437291 | 0.74 | TSHR (0.39) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL1760678 | 0.74 | — | — | |
| SCHEMBL31351425 | 0.74 | TSHR (0.35) | TSHRALDH1A1MAPTUSP2CYP3A4 | |
| SCHEMBL31351432 | 0.74 | ALDH1A1 (0.37) | TSHRALDH1A1MAPTUSP2CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | claimed |
| EP-0637902-A1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC. (US) | 1995-02-08 | — | — | EP | claimed |
| US-20230111586-A1 | CONSUMABLE FOR ANALYTE DETECTION | ALIGHT SCIENCES INC. | 2023-04-13 | — | — | US | disclosed |
| CN-115920796-A | Functionalized surfaces and preparation thereof | 特韦斯特生物科学公司 | 2023-04-07 | — | — | CN | disclosed |
| US-9909986-B2 | Thickness determination and layer characterization using terahertz scanning reflectometry | APPLIED RESEARCH AND PHOTONICS, INC. (US) | 2018-03-06 | — | — | US | disclosed |
| US-20150316475-A1 | THICKNESS DETERMINATION AND LAYER CHARACTERIZATION USING TERAHERTZ SCANNING REFLECTOMETRY | APPLIED RES AND PHOTONICS INC (US) | 2015-11-05 | — | — | US | disclosed |
| EP-1037511-B1 | Surface treatment of copper to prevent microcracking in flexible circuits | JX NIPPON MINING & METALS CORP (JP) | 2012-07-18 | — | — | EP | disclosed |
| US-7575781-B2 | Applying polymer coating to substrate by performing a bake-out cycle with a chemical vapor deposition system and performing a deposition cycle with the chemical vapor deposition system; enhances adherence of the polymeric materials to the surface of the substrate; coating medical equipment, stents | SUR MODICS, INC. (US) | 2009-08-18 | — | — | US | disclosed |
| US-20090169857-A1 | HIGHLY POROUS LAYERS MADE OF MOF MATERIALS AND METHOD FOR PRODUCING SUCH LAYERS | SUD-CHEMIE AG (DE) | 2009-07-02 | — | — | US | disclosed |
| US-20090130735-A1 | Static Support Bed for Purification, Separation, Detection, Modification and/or Immobilization of Target Entities and Method of Using Thereof | DRO BIOSYSTEMS, S. L. (ES) | 2009-05-21 | — | — | US | disclosed |
| EP-1910533-A2 | STATIC SUPPORT BED FOR PURIFICATION, SEPARATION, DETECTION, MODIFICATION AND/OR IMMOBILIZATION OF TARGET ENTITIES AND METHOD USING THEREOF | Dro Biosystems, S.L. (ES) | 2008-04-16 | — | — | EP | disclosed |
| EP-1037511-A2 | Surface treatment of copper to prevent microcracking in flexible circuits | GA-TEK Inc. (US) | 2000-09-20 | — | — | EP | disclosed |
| US-6086743-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS, INC. (US) | 2000-07-11 | — | — | US | disclosed |
| EP-0974685-A1 | Metal foil with improved bonding to substrates and method for making said foil | Gould Electronics Inc. (US) | 2000-01-26 | — | — | EP | disclosed |
| US-5908542-A | CONTACTING A METAL FOIL WITH AN ACIDIC SOLUTION; PLACING THE METAL FOIL IN A NICKEL TREATMENT BATH AND APPLYING A CURRENT THROUGH THE NICKEL TREATMENT BATH, WHEREIN THE NICKEL TREATMENT BATH CONTAINS AT LEAST ABOUT TWO PLATING ZONES, | GOULD ELECTRONICS INC. (US) | 1999-06-01 | — | — | US | disclosed |
| EP-0637902-B1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC (US) | 1999-03-31 | — | — | EP | disclosed |
| US-5885436-A | Adhesion enhancement for metal foil | GOULD ELECTRONICS INC. (US) | 1999-03-23 | — | — | US | disclosed |
| EP-0896502-A1 | Method of treating metal foil for enhancing adhesion | Gould Electronics Inc. (US) | 1999-02-10 | — | — | EP | disclosed |
| US-5622782-A | USEFUL IN MANUFACTURE OF PRINTED CIRCUIT BOARDS | GOULD INC. (US) | 1997-04-22 | — | — | US | disclosed |
| EP-0637902-A1 | Metallic foil with adhesion promoting layer | GOULD ELECTRONICS INC. (US) | 1995-02-08 | — | — | EP | disclosed |