SCHEMBL419927

SCHEMBL419927

C=C(C)COCCCC([SiH3])(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21066743 0.93 CES2 (0.34)
SCHEMBL21066697 0.93 CES2 (0.34)
SCHEMBL8103228 0.89
SCHEMBL35611 0.84
SCHEMBL3917251 0.83
SCHEMBL3149473 0.82 CES2 (0.31)
SCHEMBL3923673 0.81
SCHEMBL23321943 0.79
SCHEMBL23321708 0.79
SCHEMBL3429102 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 835 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118221883-A Multilayer core-shell structure polymer and preparation method and application thereof 中化学科学技术研究有限公司 2024-06-21 CN claimed
CN-117209673-B Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2024-04-26 CN claimed
CN-117209673-A Flame-retardant low-temperature toughening synergistic anti-dripping agent and preparation method thereof 铨盛聚碳科技股份有限公司 2023-12-12 CN claimed
CN-111607227-B Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-02-28 CN claimed
CN-115561966-A Chemical amplification type negative photosensitive polyimide coating adhesive and application 明士(北京)新材料开发有限公司 2023-01-03 CN claimed
CN-114874441-B Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995060-B Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 CN claimed
CN-114995060-A Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-114995061-A Low-water-absorption positive photosensitive resin composition and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-09-02 CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 CN claimed
EP-1469002-A1 Method for stabilizing unsaturated organo-silicon compounds Wacker-Chemie GmbH (DE) 2004-10-20 EP claimed
WO-2004081664-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-09-23 WO claimed
WO-2004074349-A1 SILICON-ACRYLATE IMPACT MODIFIER GENERAL ELECTRIC COMPANY (US) 2004-09-02 WO claimed
US-20040162399-A1 impact modifier composition comprises structural units derived from: at least one silicone rubber monomer, a branched acrylate rubber monomer GENERAL ELECTRIC COMPANY 2004-08-19 US claimed
US-6638617-B2 Smokeless, flameproofing and flexible multilayer insulators used as coverings for wires comprising mixtures of halogen-free thermoplastic resins and organic silicon compounds JUDD WIRE, INC. 2003-10-28 US claimed
US-20020096356-A1 Dual layer insulation system KIM YOUNG JOON (US) 2002-07-25 US claimed
US-6169149-B1 EMULSION POLYMERIZATION OF AN AQUEOUS DISPERSION OF SILICONE RUBBER PARTICLES OF SPECIFIED SIZE WITH ACRYLATE RUBBER MONOMERS FOLLOWED BY GRAFTING WITH ALKENYL CONTAINING MATERIAL; IMPACT MODIFIERS WHICH ENHANCE WEATHER RESISTANCE GENERAL ELECTRIC COMPANY 2001-01-02 US claimed
US-5589219-A POLYOLEFIN INSULATING COATING SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 1996-12-31 US claimed
EP-0474252-B1 Flame-retardant resin composition and insulated electrical wire employing the same SUMITOMO ELECTRIC INDUSTRIES (JP) 1995-05-24 EP claimed
US-5236985-A Obtained by irradiating with ionizing radiation composition of thermoplastic resin, magnesium hydroxide, organosilicon compound containing acrylic group SUMITOMO ELECTRIC INDUSTRIES LTD. (JP) 1993-08-17 US claimed