SCHEMBL3149473

SCHEMBL3149473

C=C(C)COCCCC([SiH3])(OCC)OCC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21066742 0.95 CES2 (0.33) CES2
SCHEMBL21066733 0.93 CES2 (0.36) CES2
SCHEMBL21066698 0.93 CES2 (0.36) CES2
SCHEMBL3917251 0.83
SCHEMBL419927 0.82
SCHEMBL23321943 0.80
SCHEMBL20555057 0.80
SCHEMBL9226773 0.79 CES2 (0.32) CES2
SCHEMBL536964 0.78
SCHEMBL3923673 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118221883-A Multilayer core-shell structure polymer and preparation method and application thereof 中化学科学技术研究有限公司 2024-06-21 CN claimed
US-12486371-B2 Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2025-12-02 US disclosed
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-27 US disclosed
CN-119866352-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2025-04-22 CN disclosed
US-12133339-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-10-29 US disclosed
WO-2024162319-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-08-08 WO disclosed
WO-2024162321-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2024-08-08 WO disclosed
US-20240191030-A1 RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-06-13 US disclosed
US-20240182644-A1 CURABLE RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-06-06 US disclosed
US-20240174809-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2024-05-30 US disclosed
US-5414065-A Polymer comprising fluoroalkyl group, a method of preparation thereof, a surface active agent, a surface treatment agent and a coating composition NOF CORPORATION (JP) 1995-05-09 US disclosed
EP-0355927-B1 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor ASAHI CHEMICAL IND (JP) 1994-11-23 EP disclosed
EP-0304136-B1 Novel photosensitive composition ASAHI CHEMICAL IND (JP) 1994-06-29 EP disclosed
US-5324803-A End groups derived from fluoroalkanoyl peroxide; oil and water repellent NOF CORPORATION (JP) 1994-06-28 US disclosed
EP-0537669-A1 A polymer comprising fluoroalkyl group, a method of preparation thereof, a surface active agent, a surface treatment agent and a coating composition NOF CORPORATION (JP) 1993-04-21 EP disclosed
US-5023298-A Blend of polymer containing carboxylic anhydride, oxazolidine compound, and alkoxysilyl groups NIPPON PAINT CO., LTD. (JP) 1991-06-11 US disclosed
US-5019482-A Polymer/oxime ester/coumarin compound photosensitive composition ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-05-28 US disclosed
EP-0376293-A2 Curable composition NIPPON PAINT CO., LTD. (JP) 1990-07-04 EP disclosed
EP-0355927-A2 A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1990-02-28 EP disclosed
EP-0304136-A2 Novel photosensitive composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-02-22 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12312323-B2 Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device ASH2L, RER1, SEM1 CES2 2153/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.