⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2305409 | 0.90 | — | — | |
| SCHEMBL8762300 | 0.82 | — | — | |
| SCHEMBL17373038 | 0.82 | — | — | |
| SCHEMBL28033411 | 0.80 | — | — | |
| SCHEMBL8575941 | 0.79 | — | — | |
| SCHEMBL17373044 | 0.79 | — | — | |
| SCHEMBL13849903 | 0.79 | — | — | |
| SCHEMBL5161785 | 0.78 | — | — | |
| SCHEMBL402873 | 0.76 | — | — | |
| SCHEMBL10519281 | 0.76 | ALDH1A1 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7507783-B2 | Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process | BREWER SCIENCE INC. (US) | 2009-03-24 | — | — | US | claimed |
| US-20040229158-A1 | Thermally curable middle layer for 193-NM trilayer resist process | ARMY, USA BY THE SECRETARY OF THE | 2004-11-18 | — | — | US | claimed |
| WO-2004076465-A2 | SILYL ACRYLATE AND POSS COMPOSITIONS USED IN MICROLITHOGRAPHIC PROCESSES | BREWER SCIENCE INC. (US) | 2004-09-10 | — | — | WO | claimed |
| US-11193928-B2 | Unmanned vehicle based detection of chemical warfare agents | INTELLIGENT OPTICAL SYSTEMS, INC. (US) | 2021-12-07 | — | — | US | disclosed |
| US-10723845-B2 | Process for preparing linear carbosiloxane polymers | DOW SILICONES CORPORATION (US) | 2020-07-28 | — | — | US | disclosed |
| US-20200079911-A1 | PROCESS FOR PREPARING LINEAR CARBOSILOXANE POLYMERS | DOW CORNING EUROPE S.A. | 2020-03-12 | — | — | US | disclosed |
| EP-3153540-B1 | PROCESS FOR PREPARING LINEAR CARBOSILOXANE POLYMERS | DOW CORNING (US) | 2018-06-06 | — | — | EP | disclosed |
| WO-2017062091-A1 | PROCESS FOR PREPARING LINEAR CARBOSILOXANE POLYMERS | DOW CORNING CORPORATION (US) | 2017-04-13 | — | — | WO | disclosed |
| EP-3153540-A1 | PROCESS FOR PREPARING LINEAR CARBOSILOXANE POLYMERS | Dow Corning Corporation (US) | 2017-04-12 | — | — | EP | disclosed |
| US-9541676-B2 | Amphiphilic siloxane-containing vinylic monomers and uses thereof | NOVARTIS AG (CH) | 2017-01-10 | — | — | US | disclosed |
| US-20150309213-A1 | AMPHIPHILIC SILOXANE-CONTAINING VINYLIC MONOMERS AND USES THEREOF | ALCON INC. (CH) | 2015-10-29 | — | — | US | disclosed |
| US-20130295342-A1 | ACTIVE ENERGY RAY-CURABLE INK COMPOSITION, INKJET RECORDING METHOD, DECORATIVE SHEET, DECORATIVE SHEET MOLDED PRODUCT, METHOD FOR PRODUCING IN-MOLD MOLDED PRODUCT, AND IN-MOLD MOLDED PRODUCT | FUJIFILM CORPORATION (JP) | 2013-11-07 | — | — | US | disclosed |
| US-7902392-B2 | Method for the production of organosilicon compounds comprising carboxy radicals | WACKER CHEMIE AG (DE) | 2011-03-08 | — | — | US | disclosed |
| US-20090221842-A1 | METHOD FOR THE PRODUCTION OF ORGANOSILICON COMPOUNDS COMPRISING CARBOXY RADICALS | WACKER CHEMIE AG (DE) | 2009-09-03 | — | — | US | disclosed |
| WO-2009057821-A1 | MICROPARTICLE OF METAL OR METAL OXIDE HAVING SILICON-CONTAINING ORGANIC GROUP, AND METHOD FOR PRODUCING THE SAME | DOW CORNING TORAY CO., LTD. (JP) | 2009-05-07 | — | — | WO | disclosed |
| US-7507783-B2 | Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process | BREWER SCIENCE INC. (US) | 2009-03-24 | — | — | US | disclosed |
| US-7074950-B2 | Process for preparing organosilicon compounds | WACKER-CHEMIE GMBH (DE) | 2006-07-11 | — | — | US | disclosed |
| US-20050137412-A1 | Process for preparing organosilicon compounds | WACKER-CHEMIE GMBH (DE) | 2005-06-23 | — | — | US | disclosed |
| US-20040229158-A1 | Thermally curable middle layer for 193-NM trilayer resist process | ARMY, USA BY THE SECRETARY OF THE | 2004-11-18 | — | — | US | disclosed |
| WO-2004076465-A2 | SILYL ACRYLATE AND POSS COMPOSITIONS USED IN MICROLITHOGRAPHIC PROCESSES | BREWER SCIENCE INC. (US) | 2004-09-10 | — | — | WO | disclosed |