SCHEMBL4239654

SCHEMBL4239654

C=CC(=O)C(O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9575274 0.80
SCHEMBL5935196 0.77 GPR84 (0.47)
SCHEMBL4891087 0.76
SCHEMBL812136 0.76
SCHEMBL27570058 0.76
SCHEMBL27756667 0.76
SCHEMBL15368024 0.76
SCHEMBL11116239 0.76
SCHEMBL15368020 0.76
Acrylic Acid SCHEMBL29158070 0.75 LMNA (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113759632-B Washable stretchable electronic paper display device and preparation method thereof 中山大学 2024-03-12 CN claimed
CN-113440418-B Dental polymerizable composition 株式会社GC 2023-12-26 CN disclosed
EP-2103445-B1 Heat resistance improver and reversible thermosensitive recording medium RICOH CO LTD (JP) 2015-05-06 EP disclosed
US-8324399-B2 Heat resistance improver and reversible thermosensitive recording medium RICOH COMPANY, LTD. (JP) 2012-12-04 US disclosed
EP-2009030-B1 RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE OTSUKA CHEMICAL CO LTD (JP) 2012-11-07 EP disclosed
CN-101421312-B resin composition and heat-resistant pressure-sensitive adhesive OTSUKA CHEMICAL CO LTD 2011-02-09 CN disclosed
US-20090239747-A1 HEAT RESISTANCE IMPROVER AND REVERSIBLE THERMOSENSITIVE RECORDING MEDIUM RICOH COMPANY, LTD. (JP) 2009-09-24 US disclosed
EP-2103445-A1 Heat resistance improver and reversible thermosensitive recording medium Ricoh Company, Ltd. (JP) 2009-09-23 EP disclosed
CN-101421312-A Resin composition and heat-resistant pressure-sensitive adhesive OTSUKA CHEMICAL CO LTD (JP) 2009-04-29 CN disclosed
EP-2009030-A1 RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE Otsuka Chemical Co., Ltd. (JP) 2008-12-31 EP disclosed
CN-1308487-C Rust inhibitor and rust inhibiting method using the same OTSUKA CHEMICAL CO LTD (JP) 2007-04-04 CN disclosed
CN-1650049-A Rust inhibitor and rust inhibiting method using the same OTSUKA CHEMICAL CO LTD (JP) 2005-08-03 CN disclosed
EP-1357193-A1 Preparation of pyrazines SOCIETE DES PRODUITS NESTLE S.A. (CH) 2003-10-29 EP disclosed
EP-0539655-A2 Blends of comb-shaped copolymers of a macromolecular monomer of polylactone with polymer (s) THE B.F. GOODRICH COMPANY (US) 1993-05-05 EP disclosed
US-5120790-A Combatible THE B. F. GOODRICH COMPANY (US) 1992-06-09 US disclosed
US-5061772-A EMULSION POLYMERIZATION OF ACRYLATED POLYLACTONE IN ETHYLENICALLY UNSATURATED COMONOMER THE B. F. GOODRICH COMPANY (US) 1991-10-29 US disclosed
US-4983689-A Using an oxonium salt cationic initiator at a low temperature; by-product inhibition; comb polymers; polyurethane coatings NOVEON IP HOLDINGS CORP., FORMERLY KNOWN AS PMD HOLDINGS CORP. 1991-01-08 US disclosed