SCHEMBL4249969

SCHEMBL4249969

NCCNCCC[SiH2]O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6901948 0.92 CA12 (0.52)
SCHEMBL29003974 0.88 CA12 (0.56)
SCHEMBL599023 0.76
SCHEMBL4249966 0.74
SCHEMBL7874764 0.74
SCHEMBL11309337 0.74 CA12 (0.71)
SCHEMBL1228526 0.73 CA12 (0.48)
SCHEMBL26667 0.73 CA12 (0.85)
SCHEMBL345134 0.73 CA12 (1.00)
SCHEMBL15381 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3221911-A1 SURFACE TREATED SILICON CONTAINING ACTIVE MATERIALS FOR ELECTROCHEMICAL CELLS Nexeon Limited (GB) 2017-09-27 EP claimed
US-20160149207-A1 SURFACE TREATED SILICON CONTAINING ACTIVE MATERIALS FOR ELECTROCHEMICAL CELLS NEXEON LIMITED (GB) 2016-05-26 US claimed
CN-119403877-A Room temperature curable composition 汉高股份有限及两合公司 2025-02-07 CN disclosed
CN-107429041-B Mold underfill material for compression molding, semiconductor package, structure, and method for manufacturing semiconductor package 住友电木株式会社 2021-07-06 CN disclosed
CN-107429040-B Resin composition for sealing, semiconductor device, and method for manufacturing semiconductor device 住友电木株式会社 2021-02-19 CN disclosed
EP-3212292-B1 POLYMER COMPRISING ALKOXYSILANE GROUPS AND USE IN COSMETICS OREAL (FR) 2021-01-20 EP disclosed
CN-108473777-B Resin composition for sealing and semiconductor device 住友电木株式会社 2020-11-17 CN disclosed
EP-3221911-A1 SURFACE TREATED SILICON CONTAINING ACTIVE MATERIALS FOR ELECTROCHEMICAL CELLS Nexeon Limited (GB) 2017-09-27 EP disclosed
US-20160149207-A1 SURFACE TREATED SILICON CONTAINING ACTIVE MATERIALS FOR ELECTROCHEMICAL CELLS NEXEON LIMITED (GB) 2016-05-26 US disclosed
US-7902284-B2 Composition based on organosilicon compounds WACKER CHEMIE AG (DE) 2011-03-08 US disclosed
US-20090247684-A1 COMPOSITION BASED ON ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2009-10-01 US disclosed
US-6770700-B2 A MOLDING MATERIAL CONTAINS GLASS FLAKES FILLERS; A CURED MOLDINGS HAVING TEAR RESISTANCE, LOW COEFFICIENT OF FRICTION WACKER-CHEMIE GMBH (DE) 2004-08-03 US disclosed
EP-0928307-B2 AQUEOUS SILICON DISPERSION RHODIA CHIMIE SA (FR) 2004-06-23 EP disclosed
EP-1034209-B1 AQUEOUS SILICON DISPERSIONS, FORMULATIONS IN PARTICULAR OF PAINTS CONTAINING THEM AND ONE METHOD FOR PREPARING THEM RHODIA CHIMIE SA (FR) 2004-02-04 EP disclosed
US-6673229-B2 ELECTROCHEMICAL CELL COMPRISING CATALYST FOR PROMOTING REACTION CREATING HYDROXYL RADICAL, CATALYST BEING IMMOBILIZED IN SOLID LOCATED AT CATHODE, SOLID BEING ARRANGED SUCH THAT FLUID TO BE PURIFIED CAN CONTACT CATALYST SONY INTERNATIONAL (EUROPE) GMBH (DE) 2004-01-06 US disclosed
US-20030176560-A1 Crosslinkable compositions based on organosilicon compounds WACKER-CHEMIE GMBH (DE) 2003-09-18 US disclosed
CN-1363727-A Electrochemical apparatus and method for purification of fluid SONY INT EUROPE GMBH (DE) 2002-08-14 CN disclosed
US-20020050451-A1 Electrochemical apparatus and process for purification of fluids SONY DEUTSCHLAND GMBH (DE) 2002-05-02 US disclosed
EP-1170259-A1 Electrochemical apparatus and process for purification of fluids Sony International (Europe) GmbH (DE) 2002-01-09 EP disclosed
EP-0928307-B1 AQUEOUS SILICON DISPERSION RHODIA CHIMIE SA (FR) 2001-05-09 EP disclosed