SCHEMBL425554

SCHEMBL425554

Cc1ccccc1OCC1CO1.c1ccc(OCC2CO2)cc1.c1ccc(OCC2CO2)cc1

nearest known ligand 0.84

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.84
GLA P06280 1/20 0.84
TDP1 Q9NUW8 1/20 0.74
MEN1 O00255 2/20 0.57
KMT2A Q03164 2/20 0.57
TP53 P04637 3/20 0.57
TSHR P16473 3/20 0.57
HIF1A Q16665 2/20 0.57
CYP3A4 P08684 1/20 0.57
SMN1; SMN2 Q16637 1/20 0.57
MAPT P10636 2/20 0.51
HPGD P15428 2/20 0.51
CYP1A2 P05177 1/20 0.51
PPARG P37231 1/20 0.51
PKM P14618 3/20 0.51
DRD4 P21917 2/20 0.48
DRD2 P14416 1/20 0.48
LMNA P02545 1/20 0.47
GAA P10253 1/20 0.47
HRH3 Q9Y5N1 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28011546 1.00 ALDH1A1 (0.84) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL2525751 0.92 ALDH1A1 (1.00) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL2527037 0.92 ALDH1A1 (1.00) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL179950 0.92 ALDH1A1 (1.00) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL29424137 0.92 ALDH1A1 (1.00) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL29498775 0.92 ALDH1A1 (1.00) ALDH1A1GLATDP1MEN1KMT2A
Water SCHEMBL28245542 0.90 ALDH1A1 (0.96) ALDH1A1GLATDP1MEN1KMT2A
Methane SCHEMBL28274836 0.90 ALDH1A1 (0.96) ALDH1A1GLATDP1MEN1KMT2A
Propane SCHEMBL28104053 0.88 ALDH1A1 (0.93) ALDH1A1GLATDP1MEN1KMT2A
SCHEMBL22653916 0.87 ALDH1A1 (0.90) ALDH1A1GLATDP1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112940560-B Photosensitive solder resist ink composition, use thereof and circuit board containing same 深圳市容大感光科技股份有限公司 2022-11-29 CN claimed
CN-113754861-A Polycyclic aryl hyperbranched epoxy resin, preparation method thereof, photoluminescent solution and anticorrosive paint obtained by polycyclic aryl hyperbranched epoxy resin and application of photoluminescent solution and anticorrosive paint 北京化工大学 2021-12-07 CN claimed
WO-2024143461-A1 LAMINATE, ELECTRONIC DEVICE, COVER GLASS, AND RESIN COMPOSITION 積水化学工業株式会社 2024-07-04 WO disclosed
CN-118284511-A Laminate and electronic device 积水化学工业株式会社 2024-07-02 CN disclosed
US-20240105539-A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE KIOXIA CORPORATION (JP) 2024-03-28 US disclosed
US-11901337-B2 Semiconductor device and method of manufacturing the same KIOXIA CORPORATION (JP) 2024-02-13 US disclosed
US-11721672-B2 Semiconductor device and manufacturing method thereof KIOXIA CORPORATION (JP) 2023-08-08 US disclosed
US-11705434-B2 Semiconductor device KIOXIA CORPORATION (JP) 2023-07-18 US disclosed
US-20230089223-A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE KIOXIA CORPORATION (JP) 2023-03-23 US disclosed
WO-2023277060-A1 LAMINATE, ELECTRONIC DEVICE, RESIN COMPOSITION AND COVER GLASS 積水化学工業株式会社 2023-01-05 WO disclosed
CN-112940560-B Photosensitive solder resist ink composition, use thereof and circuit board containing same 深圳市容大感光科技股份有限公司 2022-11-29 CN disclosed
US-20030152779-A1 Functional urethane resin film and laminated film by use of the same KANSAI PAINT CO., LTD. (JP) 2003-08-14 US disclosed
US-20030148111-A1 Coated film and method of laminating the same KANSAI PAINT CO., LTD. (JP) 2003-08-07 US disclosed
US-20030138635-A1 Crosslinkable resin coating composition and an under layer thermoplastic resin film that is nonsticky, and having a tensile elongation at breakage of 50-1000% applied onto a plastic substrate KANSAI PAINT CO., LTD. (JP) 2003-07-24 US disclosed
EP-0629613-B1 Novel onium salt, photopolymerization initiator, energy ray-curing composition containing the initiator, and cured product NIPPON KAYAKU KK (JP) 1997-10-15 EP disclosed
US-5534557-A COATINGS NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1996-07-09 US disclosed
US-5502083-A SULFONIUM CATALYST NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1996-03-26 US disclosed
EP-0629613-A2 Novel onium salt, photopolymerization initiator, energy ray-curing composition containing the initiator, and cured product NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1994-12-21 EP disclosed
US-5359017-A Using an organoiron compound NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1994-10-25 US disclosed
EP-0511405-A1 CATIONICALLY POLYMERIZABLE ORGANIC MATERIAL COMPOSITION AND STABILIZATION OF SAID COMPOSITION NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1992-11-04 EP disclosed