SCHEMBL4259206

SCHEMBL4259206

C=Cc1ccc(CCCCCCc2cccc(C=C)c2)cc1

nearest known ligand 0.41

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
IGF1R P08069 1/20 0.41
ALOX15 P16050 1/20 0.41
ALDH1A1 P00352 2/20 0.40
TSHR P16473 1/20 0.40
MAOB P27338 2/20 0.37
SIGMAR1 Q99720 2/20 0.36
LPL P06858 1/20 0.36
LIPG Q9Y5X9 1/20 0.36
CYP19A1 P11511 1/20 0.35
CDK1 P06493 1/20 0.35
THRA P10827 2/20 0.35
THRB P10828 2/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL595251 0.93 TP53 (0.47) TP53TDP1IGF1RALOX15ALDH1A1
SCHEMBL28980107 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL29619588 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL1646708 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL29619561 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL29619587 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL595303 0.91 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL1648714 0.89 TP53 (0.44) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL28980213 0.89 TP53 (0.44) TP53TDP1ALDH1A1TSHRMAOB
SCHEMBL29619582 0.89 TP53 (0.44) TP53TDP1ALDH1A1TSHRMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
WO-2025126839-A1 RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2025-06-19 WO disclosed
WO-2024122426-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE 日本ゼオン株式会社 2024-06-13 WO disclosed
US-8227361-B2 Prepreg and printed wiring board using thin quartz glass cloth HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-07-24 US disclosed
US-7638564-B2 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2009-12-29 US disclosed
US-20090266591-A1 Prepreg and printed wiring board using thin quartz glass cloth RESONAC CORPORATION (JP) 2009-10-29 US disclosed
US-20080261472-A1 PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME HITACHI CHEMICAL CO., LTD. 2008-10-23 US disclosed
US-20070077413-A1 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed