SCHEMBL595251

SCHEMBL595251

C=Cc1cccc(CCCCCCc2cccc(C=C)c2)c1

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
ALDH1A1 P00352 1/20 0.41
TSHR P16473 1/20 0.41
LPL P06858 2/20 0.40
LIPG Q9Y5X9 2/20 0.40
MGLL Q99685 1/20 0.38
IGF1R P08069 1/20 0.37
ALOX15 P16050 1/20 0.37
FAAH O00519 1/20 0.37
HDAC6 Q9UBN7 1/20 0.37
SIGMAR1 Q99720 2/20 0.36
CDK1 P06493 1/20 0.35
OPRM1 P35372 1/20 0.35
OPRD1 P41143 1/20 0.35
OPRK1 P41145 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4259206 0.93 TP53 (0.41) TP53TDP1ALDH1A1TSHRLPL
SCHEMBL489093 0.91 LPL (0.53) TP53TDP1LPLLIPG
SCHEMBL8519552 0.91 LPL (0.53) TP53TDP1LPLLIPG
SCHEMBL488957 0.91 LPL (0.53) TP53TDP1LPLLIPG
SCHEMBL595016 0.89 TP53 (0.52) TP53TDP1ALDH1A1TSHRFAAH
SCHEMBL29375309 0.89 TP53 (0.52) TP53TDP1ALDH1A1TSHRFAAH
SCHEMBL5036861 0.89 LPL (0.51) TP53TDP1LPLLIPG
SCHEMBL700528 0.88 TP53 (0.44) TP53TDP1ALDH1A1TSHRLPL
SCHEMBL1645656 0.87 TP53 (0.50) TP53TDP1ALDH1A1TSHRFAAH
SCHEMBL29619562 0.87 TP53 (0.50) TP53TDP1ALDH1A1TSHRFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
WO-2025126839-A1 RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2025-06-19 WO disclosed
WO-2024122426-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE 日本ゼオン株式会社 2024-06-13 WO disclosed
US-8227361-B2 Prepreg and printed wiring board using thin quartz glass cloth HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-07-24 US disclosed
US-8115105-B2 Prepreg and its application products for low thermal expansion and low dielectric tangent HITACHI CHEMICAL CO., LTD. (JP) 2012-02-14 US disclosed
US-7638564-B2 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2009-12-29 US disclosed
US-20090266591-A1 Prepreg and printed wiring board using thin quartz glass cloth RESONAC CORPORATION (JP) 2009-10-29 US disclosed
US-20090178832-A1 PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT HITACHI CHEMICAL CO.., LTD. 2009-07-16 US disclosed
US-20080261472-A1 PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME HITACHI CHEMICAL CO., LTD. 2008-10-23 US disclosed
US-20070077413-A1 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish HITACHI CHEMICAL CO., LTD. (JP) 2007-04-05 US disclosed