SCHEMBL4266776

SCHEMBL4266776

CC=C(C)C(=O)OC1(C)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4266772 1.00
SCHEMBL10456517 0.92
SCHEMBL4631321 0.78 ALDH1A1 (0.39)
SCHEMBL21158806 0.76
SCHEMBL29117781 0.76 CYP19A1 (0.38)
SCHEMBL19666749 0.76
SCHEMBL631549 0.76
SCHEMBL22612937 0.73 EPHX1 (0.35)
SCHEMBL27997174 0.72 EPHX1 (0.38)
SCHEMBL9804280 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118339509-A Liquid crystal aligning agent and liquid crystal display element 日产化学株式会社 2024-07-12 CN disclosed
CN-118027311-A Curable resin composition and cured product obtained therefrom 佳能株式会社 2024-05-14 CN disclosed
CN-118043732-A Weak anchoring liquid crystal aligning agent, liquid crystal display element and polymer 日产化学株式会社 2024-05-14 CN disclosed
CN-112888719-B Curable resin composition and cured product obtained therefrom 佳能株式会社 2024-02-23 CN disclosed
US-11898057-B2 Weather-resistant hard coat composition for glass-substitute substrate, cured product, and laminate DAICEL CORPORATION (JP) 2024-02-13 US disclosed
CN-117460990-A Weak anchoring liquid crystal aligning agent, liquid crystal display element and copolymer 日产化学株式会社 2024-01-26 CN disclosed
US-11866608-B2 Weather-resistant hard coat composition for metal, cured product, and coated metal substrate DAICEL CORPORATION (JP) 2024-01-09 US disclosed
US-20230399479-A1 LAMINATED FILM AND FLEXIBLE DEVICE DAICEL CORPORATION (JP) 2023-12-14 US disclosed
WO-2023219075-A1 METHOD FOR MANUFACTURING SUBSTRATE EQUIPPED WITH WEAK ANCHORING ALIGNMENT FILM, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2023-11-16 WO disclosed
WO-2023190456-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2023-10-05 WO disclosed
CN-102906867-A Printed circuit board including dam for underfilling and method of manufacturing the same LG CHEMICAL LTD 2013-01-30 CN disclosed
CN-101410421-B Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board FUJI PHOTO FILM CO LTD 2011-07-27 CN disclosed
CN-101836313-A Be used for the perforated membrane with reactive polymer layer thereon of battery diaphragm and the purposes of this perforated membrane NITTO DENKO CORP 2010-09-15 CN disclosed
EP-2135684-A1 ORGANIC/INORGANIC COMPOSITE COATING FILM, STRUCTURAL COLOR FILM OBTAINED FROM THE SAME, AND PROCESSES FOR PRODUCING THESE KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2009-12-23 EP disclosed
CN-101578555-A Photocurable resin composition, cured product pattern, and printed wiring board TAIYO INK MFG CO LTD (JP) 2009-11-11 CN disclosed
CN-100539254-C Be used for battery porous film and its utilization with the carrying reactive polymer of spacer NITTO DENKO CORP SUNSTAR ENGIN (JP) 2009-09-09 CN disclosed
CN-101410421-A Photopolymerization initiator, photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board FUJIFILM CORP (JP) 2009-04-15 CN disclosed
EP-1923741-A2 Photosensitive composition TAIYO INK MFG. CO., LTD. (JP) 2008-05-21 EP disclosed
CN-101111952-A Reactive polymer-supporting porous film for battery separator and use thereof NITTO DENKO CORP (JP) 2008-01-23 CN disclosed
CN-101107565-A Pattern forming material, pattern forming apparatus and permanent pattern forming method FUJI PHOTO FILM CO LTD (JP) 2008-01-16 CN disclosed