SCHEMBL426715

SCHEMBL426715

CCCO[Si](OCCC)(OCCC)C(C)[Si](OCCC)(OCCC)OCCC

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15333172 0.83 ADRB2 (0.38)
SCHEMBL105839 0.82 HSD17B10 (0.35) HSD17B10
SCHEMBL3786079 0.80 HSD17B10 (0.33) HSD17B10
SCHEMBL107732 0.78 HSD17B10 (0.32) HSD17B10
SCHEMBL29201675 0.78 HSD17B10 (0.32) HSD17B10
SCHEMBL31142041 0.78 HSD17B10 (0.32) HSD17B10
SCHEMBL7636389 0.78 HSD17B10 (0.32) HSD17B10
SCHEMBL11455676 0.78 HSD17B10 (0.37) HSD17B10
SCHEMBL1964610 0.78 HSD17B10 (0.32) HSD17B10
SCHEMBL2399516 0.76 HSD17B10 (0.31) HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118598151-A Molecular sieve material, preparation method and application thereof 中国石油化工股份有限公司 2024-09-06 CN claimed
WO-2012139965-A1 CYANOACRYLATE ADHESIVE WITH IMPROVED WATER RESISTANCE HENKEL IRELAND LTD. (IE) 2012-10-18 WO claimed
CN-118598151-A Molecular sieve material, preparation method and application thereof 中国石油化工股份有限公司 2024-09-06 CN disclosed
US-9181356-B2 Hydrogenation catalyst composition and hydrogenation method thereof TSRC CORPORATION (TW) 2015-11-10 US disclosed
EP-1970421-B1 COATING LIQUID FOR FORMING LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM AND LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM OBTAINED FROM SUCH COATING LIQUID JGC CATALYSTS & CHEMICALS LTD (JP) 2015-04-29 EP disclosed
EP-2316862-B1 Hydrogenation catalyst composition and hydrogenation method thereof TSRC CORP (TW) 2013-12-25 EP disclosed
WO-2012139965-A1 CYANOACRYLATE ADHESIVE WITH IMPROVED WATER RESISTANCE HENKEL IRELAND LTD. (IE) 2012-10-18 WO disclosed
US-20120231575-A1 METHOD FOR PRODUCING SOLAR CELL HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-09-13 US disclosed
EP-2495771-A1 SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2012-09-05 EP disclosed
EP-2495770-A1 METHOD FOR PRODUCING SOLAR CELL Hitachi Chemical Company, Ltd. (JP) 2012-09-05 EP disclosed
CN-101829600-B Hydrogenation catalyst composition and hydrogenation method thereof TSRC CORP 2012-08-29 CN disclosed
US-20080260956-A1 Film, Silica Film and Method of Forming the Same, Composition for Forming Silica Film, and Electronic Part HITACHI CHEMICAL CO., LTD. (JP) 2008-10-23 US disclosed
EP-1970421-A1 COATING LIQUID FOR FORMING LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM AND LOW DIELECTRIC CONSTANT AMORPHOUS SILICA COATING FILM OBTAINED FROM SUCH COATING LIQUID CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2008-09-17 EP disclosed
EP-1890172-A1 METHOD FOR FORMING ANTIREFLECTION FILM Hitachi Chemical Co., Ltd. (JP) 2008-02-20 EP disclosed
US-7297464-B2 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2007-11-20 US disclosed
EP-1829945-A1 FILM, SILICA FILM AND METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING SILICA FILM, AND ELECTRONIC PART Hitachi Chemical Co., Ltd. (JP) 2007-09-05 EP disclosed
EP-1672427-A1 RADIATION-CURING COMPOSITION, METHOD FOR STORING SAME, METHOD FOR FORMING CURED FILM, METHOD FOR FORMING PATTERN, METHOD FOR USING PATTERN, ELECTRONIC COMPONENT, AND OPTICAL WAVEGUIDE Hitachi Chemical Co., Ltd. (JP) 2006-06-21 EP disclosed
EP-1672426-A1 RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-06-21 EP disclosed
US-20050266344-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-12-01 US disclosed
US-20050239953-A1 Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide HITACHI CHEMICAL CO., LTD. (JP) 2005-10-27 US disclosed