SCHEMBL4273229

SCHEMBL4273229

Nc1ccc(Oc2cc(CO)cc(Oc3ccc(N)cc3)c2)cc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.56
TDP1 Q9NUW8 2/20 0.56
CYP3A4 P08684 1/20 0.56
TSHR P16473 1/20 0.56
MAPT P10636 4/20 0.55
SMN1; SMN2 Q16637 3/20 0.55
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
MITF O75030 1/20 0.55
GAA P10253 1/20 0.55
GFER P55789 1/20 0.55
NLRP1 Q9C000 1/20 0.55
NOD2 Q9HC29 1/20 0.55
NPC1 O15118 2/20 0.53
RAB9A P51151 2/20 0.53
NLRP3 Q96P20 1/20 0.53
ST14 Q9Y5Y6 5/20 0.50
LTA4H P09960 1/20 0.48
MAOA P21397 2/20 0.48
TEAD4 Q15561 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23748641 0.85 LTA4H (0.65) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL13452875 0.83 ALDH1A1 (0.66) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL30063 0.82 ALDH1A1 (0.82) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL24080182 0.80 CYP19A1 (0.67) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL2349223 0.79 LTA4H (0.69) TSHRMEN1KMT2ANPC1RAB9A
SCHEMBL23759 0.78 MEN1 (0.79) ALDH1A1TDP1CYP3A4TSHRMAPT
Ethylene Glycol SCHEMBL19307699 0.78 ALDH1A1 (0.74) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL29576151 0.77 ALDH1A1 (0.64) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL4455485 0.75 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAPT
SCHEMBL65211 0.75 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112759763-B Polyimide composite glue solution, black matte polyimide material, preparation and application 株洲时代新材料科技股份有限公司 2022-05-17 CN disclosed
EP-2188330-B1 POLYIMIDE POLYMER WITH OLIGOMERIC SILSESQUIOXANE NEXOLVE CORP (US) 2016-11-30 EP disclosed
EP-2433978-B1 POLYIMIDE POLYMER WITH OLIGOMERIC SILSESQUIOXANE NEXOLVE CORP (US) 2016-07-27 EP disclosed
US-7619042-B2 Polyimide polymer with oligomeric silsesquioxane NEXOLVE CORPORATION (US) 2009-11-17 US disclosed
US-20090069508-A1 POLYIMIDE POLYMER WITH OLIGOMERIC SILSESQUIOXANE MANTECH SRS TECHNOLOGIES, INC. (US) 2009-03-12 US disclosed
US-6709804-B2 Printed wiring board and semiconductor device and processes to prepare the same RIKEN (JP) 2004-03-23 US disclosed
US-20030194621-A1 Polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains, e.g., cyclopentadiene-, furan- or thiophene-groups RIKEN (JP) 2003-10-16 US disclosed
US-6528231-B1 Photosensitive resin composition can form a resin layer having excellent heat resistance RIKEN (JP) 2003-03-04 US disclosed