⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9615755 | 0.90 | KDM1A (0.30) | — | |
| SCHEMBL546443 | 0.84 | KCNH2 (0.32) | — | |
| SCHEMBL6826930 | 0.82 | KCNH2 (0.34) | — | |
| SCHEMBL6826962 | 0.80 | KCNH2 (0.33) | — | |
| SCHEMBL9152007 | 0.80 | — | — | |
| SCHEMBL10859728 | 0.80 | — | — | |
| SCHEMBL1053239 | 0.80 | — | — | |
| SCHEMBL454510 | 0.80 | — | — | |
| SCHEMBL7418036 | 0.80 | RAB9A (0.31) | — | |
| SCHEMBL15092951 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2260062-B1 | ADHESION TO PLASTIC WITH BLOCK COPOLYMERS OBTAINED USING RAFT | DSM IP ASSETS BV (NL) | 2019-08-07 | — | — | EP | claimed |
| US-11965050-B2 | Waterborne crosslinkable dispersions | COVESTRO (NETHERLANDS) B.V. (NL) | 2024-04-23 | — | — | US | disclosed |
| CN-111491984-B | Aqueous crosslinkable dispersions | 科思创(荷兰)有限公司 | 2023-09-29 | — | — | CN | disclosed |
| CN-111491983-B | aqueous dispersion | 科思创(荷兰)有限公司 | 2023-08-25 | — | — | CN | disclosed |
| CN-113234374-B | Coating for plastic substrates | PPG工业俄亥俄公司 | 2022-12-20 | — | — | CN | disclosed |
| EP-3712222-B1 | RADICAL-CURABLE ADHESIVE COMPOSITION, AND ADHESIVE | SHOWA DENKO KK (JP) | 2022-12-07 | — | — | EP | disclosed |
| US-11459419-B2 | Waterborne dispersions | COVESTRO (NETHERLANDS) B.V. (NL) | 2022-10-04 | — | — | US | disclosed |
| CN-110139879-B | Adhesion promoters for plastic substrates containing random copolymers | PPG工业俄亥俄公司 | 2022-06-07 | — | — | CN | disclosed |
| EP-3728412-B1 | WATERBORNE CROSSLINKABLE DISPERSIONS | COVESTRO NETHERLANDS BV (NL) | 2022-01-26 | — | — | EP | disclosed |
| EP-3728413-B1 | WATERBORNE DISPERSIONS | COVESTRO NETHERLANDS BV (NL) | 2022-01-26 | — | — | EP | disclosed |
| US-7396885-B2 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN-EI KAGAKU CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20050019582-A1 | BLEND CURABLE AT A LOW AND HIGH TEMPERATURE OF AN EPOXY RESIN-UNSATURATED ALIPHATIC ACID ADDUCT, A (METH)ACRYLATE, A FREE RADICAL INITIATOR, A CRYSTALLIZABLE EPOXY RESIN, AND LATENT CURING AGENT; SMOOTH UNDERCOATINGS FOR CIRCUIT BOARDS | SATO KIYOSHI (JP) | 2005-01-27 | — | — | US | disclosed |
| EP-1477977-A1 | ULTRAVIOLET-CURABLE RESIN COMPOSITION FOR OPTICAL DISCS | Nagase Chemtex Corporation (JP) | 2004-11-17 | — | — | EP | disclosed |
| US-6818681-B2 | ADDUCT OF E-CAPROLACTONE-MODIFIED (METH)ACRYLATE TO EPI-BIS TYPE EPOXY RESIN; (METH)ACRYLATE MONOMER; AND 2,2-DIMETHOXY-2-PHENYLACETOPHENONE, BENZOYL ETHYL ETHER AND/OR BENZOYLISOBUTYL ETHER POLYMERIZATION INITIATOR | NAGASE CHEMTEX CORPORATION (JP) | 2004-11-16 | — | — | US | disclosed |
| US-6812299-B2 | BLEND CURABLE AT A LOW AND HIGH TEMPERATURE OF AN EPOXY RESIN-UNSATURATED ALIPHATIC ACID ADDUCT, A (METH)ACRYLATE, A FREE RADICAL INITIATOR, A CRYSTALLIZABLE EPOXY RESIN, AND LATENT CURING AGENT; SMOOTH UNDERCOATINGS FOR CIRCUIT BOARDS | SAN-EI KAGAKU CO., LTD. (JP) | 2004-11-02 | — | — | US | disclosed |
| US-20040167302-A1 | Ultraviolet-curable resin composition for optical discs | NAGASE CHEMTEX CORPORATION (JP) | 2004-08-26 | — | — | US | disclosed |
| US-20030215567-A1 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN-EI KAGAKU CO., LTD. | 2003-11-20 | — | — | US | disclosed |
| US-20030162898-A1 | Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards | SAN-EI KAGAKU CO., LTD. (JP) | 2003-08-28 | — | — | US | disclosed |
| US-5698285-A | PHOTOCURABLE | THREE BOND CO., LTD. (JP) | 1997-12-16 | — | — | US | disclosed |
| US-5300536-A | Vinyl compound capable of free radical polymerization | TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) | 1994-04-05 | — | — | US | disclosed |