Methacrylic Acid

Methacrylic Acid

SCHEMBL4304880

C=C(C)C(=O)O.C=CC(=C)C=C

nearest known ligand 0.47

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Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.47
TSHR P16473 4/20 0.42
TP53 P04637 1/20 0.42
LMNA P02545 1/20 0.42
TDP1 Q9NUW8 2/20 0.38
ALOX15 P16050 1/20 0.37
HSD17B10 Q99714 1/20 0.37
FGFR4 P22455 1/20 0.33
FFAR3 O14843 1/20 0.33
LCK P06239 1/20 0.33
FYN P06241 1/20 0.33
MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL9236258 1.00 ALDH1A1 (0.47) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL9726633 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL161378 0.85 ALDH1A1 (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL9818367 0.85 ALDH1A1 (0.69) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL5964487 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL23071293 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL5013791 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL137716 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL9066064 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1
Methacrylic Acid SCHEMBL9681348 0.85 LMNA (0.62) ALDH1A1TSHRTP53LMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1831897-A4 PLASTIC CONDUCTIVE PARTICLES AND MANUFACTURING METHOD THEREOF DONGBU HITEK CO LTD (KR) 2009-01-28 EP disclosed
US-20080206567-A1 Plastic Conductive Particles and Manufacturing Method Thereof DONGBU HITEK CO., LTD. (KR) 2008-08-28 US disclosed
CN-101091224-A Plastic conductive particles and manufacturing method thereof DONGBU HITEK CO LTD (KR) 2007-12-19 CN disclosed
EP-1831897-A1 PLASTIC CONDUCTIVE PARTICLES AND MANUFACTURING METHOD THEREOF Dongbu Hitek Co., Ltd. (KR) 2007-09-12 EP disclosed
US-7205035-B2 Thermoset composition, method, and article GENERAL ELECTRIC COMPANY (US) 2007-04-17 US disclosed
EP-1497373-B1 THERMOSET COMPOSITION, METHOD, AND ARTICLE GEN ELECTRIC (US) 2007-02-07 EP disclosed
EP-1497372-B1 THERMOSET COMPOSITION, METHOD AND ARTICLE GEN ELECTRIC (US) 2007-01-17 EP disclosed
WO-2006071072-A1 PLASTIC CONDUCTIVE PARTICLES AND MANUFACTURING METHOD THEREOF DONGBU HITEK CO., LTD. (KR) 2006-07-06 WO disclosed
US-6878782-B2 Thermoset composition, method, and article GENERAL ELECTRIC (US) 2005-04-12 US disclosed
EP-1497372-A1 THERMOSET COMPOSITION, METHOD AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
EP-1497373-A1 THERMOSET COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (US) 2005-01-19 EP disclosed
US-20030220460-A1 THERMOSET COMPOSITION, METHOD, AND ARTICLE CITIBANK, N.A., AS COLLATERAL AGENT 2003-11-27 US disclosed
US-20030215588-A1 Thermoset composition, method, and article CITIBANK, N.A., AS COLLATERAL AGENT 2003-11-20 US disclosed
WO-2003087224-A1 THERMOSET COMPOSITION, METHOD, AND ARTICLE GENERAL ELECTRIC COMPANY (A NEW YORK CORPORATION) (US) 2003-10-23 WO disclosed
WO-2003087223-A1 THERMOSET COMPOSITION, METHOD AND ARTICLE GENERAL ELECTRIC COMPANY (A NEW YORK CORPORATION) (US) 2003-10-23 WO disclosed
US-20020169256-A1 Thermoset composition, method, and article SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-11-14 US disclosed