Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.43 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | BIRC2 | Q13490 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | ZDHHC7 | Q9NXF8 | 1/20 | 0.30 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28658877 | 0.85 | TSHR (0.33) | TSHRHSD17B10KDM4EALDH1A1SMN1; SMN2 | |
| SCHEMBL4447146 | 0.79 | TSHR (0.31) | TSHR | |
| SCHEMBL4447143 | 0.79 | TSHR (0.31) | TSHR | |
| SCHEMBL9881104 | 0.77 | HRH4 (0.32) | — | |
| SCHEMBL6850000 | 0.77 | CA1 (0.47) | TSHRCA14MAPTHSD17B10CA1 | |
| SCHEMBL5191381 | 0.77 | CA1 (0.47) | TSHRCA14MAPTHSD17B10CA1 | |
| SCHEMBL29151546 | 0.76 | ALDH1A1 (0.31) | KDM4EALDH1A1 | |
| SCHEMBL26458075 | 0.76 | KMT2A (0.35) | TSHRL3MBTL1SMN1; SMN2 | |
| Hydrochloric Acid SCHEMBL4084373 | 0.75 | CA1 (0.46) | TSHRCA14MAPTHSD17B10CA1 | |
| Hydrochloric Acid SCHEMBL9062189 | 0.75 | HRH4 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090326100-A1 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-12-31 | — | — | US | disclosed |