SCHEMBL4311313

SCHEMBL4311313

CC(N)C(C)CN.CO[SiH](OC)OC

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12904871 0.81
SCHEMBL869711 0.81
SCHEMBL10272347 0.81
SCHEMBL19733683 0.81
SCHEMBL20663535 0.81
Isopropylamine SCHEMBL28786876 0.74
SCHEMBL3679094 0.70
Ethylenediamine SCHEMBL6036846 0.68 DNM1 (0.30) ALDH1A1
Ethylamine SCHEMBL28061240 0.68 DNM1 (0.30) ALDH1A1
Isobutane SCHEMBL28749087 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4833093-A Method of silanization of surfaces FORSVARETS FORSKNINGSANSTALT (SE) 1989-05-23 US claimed
EP-0100660-A2 A bioreactor and a process for the production thereof SHIMADZU CORPORATION (JP) 1984-02-15 EP claimed
US-4336319-A Light-solubilizable composition FUJI PHOTO FILM CO., LTD. (JP) 1982-06-22 US claimed
EP-3877449-A1 CURABLE SEALANT COMPOSITIONS, SEAL CAP, AND METHODS OF MAKING AND USING THE SAME 3M Innovative Properties Company (US) 2021-09-15 EP disclosed
EP-2548674-B1 BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING KAO CORP (JP) 2019-05-01 EP disclosed
EP-2548674-A1 BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING Kao Corporation (JP) 2013-01-23 EP disclosed
US-20130008625-A1 BINDER COMPOSITION FOR USE IN MOLD MANUFACTURING KAO CORPORATION (JP) 2013-01-10 US disclosed
US-7595157-B2 Microarrays utilizing hydrogels BIOCEPT, INC. (US) 2009-09-29 US disclosed
EP-1779113-A1 MICROARRAYS UTILIZING HYDROGELS Biocept, Inc. (US) 2007-05-02 EP disclosed
WO-2006023323-A1 MICROARRAYS UTILIZING HYDROGELS BIOCEPT, INC. (US) 2006-03-02 WO disclosed
US-20060040274-A1 Microarrays utilizing hydrogels BIOCEPT, INC. (US) 2006-02-23 US disclosed
WO-2002051930-A1 POLYPROPYLENE RESIN COMPOSITION HAVING THERMAL RESISTANCE, HIGH RIGIDITY AND LOW WARPAGE PROPERTIES SAMSUNG GENERAL CHEMICALS CO., LTD. (KR) 2002-07-04 WO disclosed
EP-0645427-B1 Mica-reinforced propylene resin composition SUMITOMO CHEMICAL CO (JP) 1997-12-03 EP disclosed
US-5494948-A OBTAINED BY HEATING AND MELTING MIXTURE CONTAINING CRYSTALLINE POLYPROPYLENE, MICA TREATED WITH ORGANOSILANE COMPOUND, BISMALEIMIDE COMPOUND, ORGANIC PEROXIDE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-02-27 US disclosed
EP-0645427-A1 Mica-reinforced propylene resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-03-29 EP disclosed
EP-0424135-B1 Imide prepolymers and cured products thereof MITSUI PETROCHEMICAL IND (JP) 1994-12-07 EP disclosed
US-5102981-A Heat resistance and flame retardance MITSUI PETROCHEMICAL INDUSTRIES LTD. (JP) 1992-04-07 US disclosed
EP-0048461-A2 Vinyl resin composition containing silyl groups and a paint comprising said composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1982-03-31 EP disclosed