SCHEMBL4312008

SCHEMBL4312008

CCC(OC(=O)/C=C/C(=O)OC(CC)[Si](OC)(OC)OC)[Si](OC)(OC)OC

nearest known ligand 0.36

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 5/20 0.36
KEAP1 Q14145 1/20 0.36
NFE2L2 Q16236 1/20 0.36
ATM Q13315 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9575669 1.00 HCAR2 (0.36) HCAR2KEAP1NFE2L2ATM
SCHEMBL4312022 1.00 HCAR2 (0.36) HCAR2KEAP1NFE2L2ATM
SCHEMBL7096197 0.94 HCAR2 (0.46) HCAR2KEAP1NFE2L2
SCHEMBL7096200 0.94 HCAR2 (0.46) HCAR2KEAP1NFE2L2
SCHEMBL2672112 0.91
SCHEMBL758924 0.91
SCHEMBL23149457 0.89
SCHEMBL21647355 0.89
SCHEMBL9713489 0.89
SCHEMBL1414580 0.86 ALDH1A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1116761-B1 Adhesion enhancing additives for release coating compositions GEN ELECTRIC (US) 2004-04-14 EP claimed
US-6312818-B1 CATIONICALLY CURABLE FUNCTIONALIZED POLYORGANOSILOXANE; PHOTOINITIATOR; AND ANCHORAGE ADDITIVE WHICH IS A A BIS(SILANE GROUP-CONTAINING HYDROCARBYL) ESTER OF A DICARBOXYLIC ACID GENERAL ELECTRIC COMPANY 2001-11-06 US claimed
EP-1116761-A2 Adhesion enhancing additives for release coating compositions GENERAL ELECTRIC COMPANY (US) 2001-07-18 EP claimed
JP-11246765-A None JP disclosed
JP-11323134-A None JP disclosed
EP-2050782-A1 Polymer compositions SOLVAY (Société Anonyme) (BE) 2009-04-22 EP disclosed
EP-2036944-A1 Polymer compositions SOLVAY (Société Anonyme) (BE) 2009-03-18 EP disclosed
US-20060147719-A1 Curable epoxy composition with colloidal silica and phenolic resins on substrates MOMENTIVE PERFORMANCE MATERIALS INC. 2006-07-06 US disclosed
EP-0939101-B1 Liquid injection molding silicone elastomers having primerless adhesion GEN ELECTRIC (US) 2003-08-13 EP disclosed