SCHEMBL431563

SCHEMBL431563

COCOCCOC(C)O

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1720558 0.83 MEN1 (0.34) HSD17B10
SCHEMBL13191130 0.83 MEN1 (0.34) HSD17B10
SCHEMBL8958953 0.83 MEN1 (0.34) HSD17B10
SCHEMBL8057662 0.82 MEN1 (0.39) HSD17B10
SCHEMBL8069328 0.82 MEN1 (0.39) HSD17B10
SCHEMBL15160839 0.80
SCHEMBL242589 0.79
SCHEMBL8068207 0.79 ALDH1A1 (0.36) HSD17B10
SCHEMBL27503939 0.77
SCHEMBL160316 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114008424-B Tactile sensor formed on polyimide film having high total light transmittance and switching device using the same 三井化学株式会社 2025-04-08 CN disclosed
US-20250019582-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE MITSUI CHEMICALS, INC. (JP) 2025-01-16 US disclosed
WO-2024210105-A1 METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND LAYERED OBJECT FOR SEMICONDUCTOR DEVICE 三井化学株式会社 2024-10-10 WO disclosed
EP-4424749-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE Mitsui Chemicals, Inc. (JP) 2024-09-04 EP disclosed
US-20240287253-A1 PROCESS FOR POLYIMIDE SYNTHESIS AND POLYIMIDES MADE THEREFROM ZYMERGEN INC. 2024-08-29 US disclosed
WO-2024150642-A1 POLY(AMIC ACID) VARNISH, POLYIMIDE COMPOSITION, ADHESIVE, MULTILAYER OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 三井化学株式会社 2024-07-18 WO disclosed
CN-118176241-A Polyamic acid varnish, polyimide composition, and adhesive 三井化学株式会社 2024-06-11 CN disclosed
US-20240182765-A1 POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2024-06-06 US disclosed
US-20240182645-A1 POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND LAMINATE MITSUI CHEMICALS, INC. (JP) 2024-06-06 US disclosed
US-12003235-B2 Tactile sensor formed on polyimide thin film having high total light transmittance, and switching device using same MITSUI CHEMICALS, INC. (JP) 2024-06-04 US disclosed
EP-0573974-B1 Polyimide paper, polyimide composite paper and process for producing these products UNITIKA LTD (JP) 1998-09-02 EP disclosed
US-5719253-A APROTIC SOLVENT-FREE UNITIKA LTD. (JP) 1998-02-17 US disclosed
EP-0811648-A1 Polyimide precursor solution, process for the production thereof, coating or film obtained therefrom and process for producing the film Unitika Limited (JP) 1997-12-10 EP disclosed
EP-0532954-B1 Process for producing a granular material of polyimide precursor. UNITIKA LTD (JP) 1997-04-02 EP disclosed
EP-0705862-A1 Poly(amic acid) solution, use thereof and polyimide film or polyimide-coated material obtained therefrom UNITIKA LTD. (JP) 1996-04-10 EP disclosed
US-5466732-A Polyimide precursor solution, process for producing the solution and moldings and coatings obtained therefrom UNITIKA LTD. (JP) 1995-11-14 US disclosed
US-5463016-A Tetracarboxylic dianhydride undergoes polymerization with a diamine in a solvent that does not exhibit a strong mutual interaction with the polyimide precursor UNITIKA LTD. (JP) 1995-10-31 US disclosed
EP-0573974-A1 Polyimide precursor fibrid, polyimide paper, polyimide composite paper and polyimide composite board obtained therefrom, and process for producing the fibrid and the paper products UNITIKA LTD. (JP) 1993-12-15 EP disclosed
EP-0532953-A2 Polyimide precursor solution, process for producing the solution, and moldings and coatings obtained therefrom UNITIKA LTD. (JP) 1993-03-24 EP disclosed
EP-0532954-A1 Granular material of polyimide precursor, mixture comprising the material and process for producing the material UNITIKA LTD. (JP) 1993-03-24 EP disclosed