SCHEMBL4325901

SCHEMBL4325901

OC1(O)c2ccccc2-c2ccccc21

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDK2 Q15119 13/20 0.56
THRB P10828 1/20 0.54
TDP1 Q9NUW8 1/20 0.54
ALDH1A1 P00352 2/20 0.50
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
TSHR P16473 1/20 0.50
ALOX12 P18054 1/20 0.50
MAPK1 P28482 1/20 0.50
CASP1 P29466 1/20 0.50
CA7 P43166 1/20 0.50
RECQL P46063 1/20 0.50
BACE1 P56817 1/20 0.50
CA9 Q16790 1/20 0.50
EHMT2 Q96KQ7 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
HSP90AA1 P07900 1/20 0.46
HSP90AB1 P08238 1/20 0.46
APEX1 P27695 1/20 0.41
S100A4 P26447 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30899336 1.00 PDK2 (0.56) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL30773534 0.81 PDK2 (0.56) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL21842337 0.81 PDK2 (0.56) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL15613360 0.80 PDK2 (0.64) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL13615024 0.80 PDK2 (0.41) PDK2THRBTDP1
SCHEMBL30982233 0.80 CA1 (0.70) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL23936830 0.77 PDK2 (0.52) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL2239449 0.77 PDK2 (0.52) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL23798922 0.77 THRB (0.56) PDK2THRBTDP1ALDH1A1CA1
SCHEMBL30341830 0.77 PDK2 (0.52) PDK2THRBTDP1ALDH1A1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107974080-B Polyamide moulding compositions and multilayer structures made therefrom EMS专利股份公司 2021-07-20 CN claimed
US-10577478-B2 Polyamide moulding composition and multi-layered structure made therefrom EMS-PATENT AG (CH) 2020-03-03 US claimed
EP-3312224-B1 POLYAMIDE MOULDING COMPOSITION AND MULTI-LAYERED STRUCTURE MADE HEREFROM EMS PATENT AG (CH) 2018-12-26 EP claimed
WO-2024143360-A1 MODIFIED POLYCARBONATE RESIN COMPOSITION PRODUCTION METHOD, BISPHENOL PRODUCTION METHOD, RECLAIMED POLYCARBONATE RESIN, AND RECLAIMED POLYCARBONATE RESIN COMPOSITION PRODUCTION METHOD 三菱ケミカル株式会社 2024-07-04 WO disclosed
CN-118255944-A Resin composition, composite material, and cured product thereof 株式会社力森诺科 2024-06-28 CN disclosed
CN-117820522-B Olefin polymerization catalyst, preparation method and application 淄博新塑化工有限公司 2024-05-17 CN disclosed
CN-117820522-A Olefin polymerization catalyst, preparation method and application 淄博新塑化工有限公司 2024-04-05 CN disclosed
WO-2024048494-A1 METHOD FOR PRODUCING BISPHENOL AND METHOD FOR PRODUCING POLYCARBONATE RESIN 三菱ケミカル株式会社 2024-03-07 WO disclosed
US-20230366113-A1 MEMBRANE ELECTRODE ASSEMBLY FOR WATER ELECTROLYSIS, WATER ELECTROLYSIS CELL INCLUDING THE MEMBRANE ELECTRODE ASSEMBLY AND METHOD FOR FABRICATING THE MEMBRANE ELECTRODE ASSEMBLY KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2023-11-16 US disclosed
WO-2023210563-A1 COMPOSITION CONTAINING BISPHENOL, PRODUCTION METHOD FOR SAME, PRODUCTION METHOD FOR BISPHENOL A, AND PRODUCTION METHOD FOR POLYCARBONATE RESIN 三菱ケミカル株式会社 2023-11-02 WO disclosed
WO-2023163026-A1 BISPHENOL PRODUCTION METHOD, RECYCLED POLYCARBONATE RESIN PRODUCTION METHOD, EPOXY RESIN PRODUCTION METHOD, CURED EPOXY RESIN PRODUCTION METHOD, AND BISPHENOL-ALKYL CARBONATE CONDENSATE PRODUCTION METHOD 三菱ケミカル株式会社 2023-08-31 WO disclosed
EP-2816409-A1 Method for forming a resist under layer film and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2014-12-24 EP disclosed
CN-101178948-B Anisotropic conductive film composition CHEIL INDUSTRIES INC. (KR) 2012-02-01 CN disclosed
EP-2112213-A2 Organic electroluminescence device, novel platinum complex compound and novel compound capable of being a ligand thereof FUJIFILM Corporation (JP) 2009-10-28 EP disclosed
US-7608309-B2 Resin composition, film and image display device utilizing the resin composition FUJIFILM CORPORATION (JP) 2009-10-27 US disclosed
CN-101178948-A Anisotropic conductive film composition CHEIL IND INC (KR) 2008-05-14 CN disclosed
US-20060036059-A1 Resin composition, film and image display device utilizing the resin composition FUJI PHOTO FILM CO., LTD. (JP) 2006-02-16 US disclosed
EP-0684964-A1 CARBONATE POLYMERS CONTAINING ETHENYL ARYL MOIETIES THE DOW CHEMICAL COMPANY (US) 1995-12-06 EP disclosed
US-5362838-A Styrene terminated polycarbonates; crosslinked molding materials VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY (US) 1994-11-08 US disclosed
WO-1994019390-A1 CARBONATE POLYMERS CONTAINING ETHENYL ARYL MOIETIES THE DOW CHEMICAL COMPANY (US) 1994-09-01 WO disclosed