Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.67 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.55 |
| ▸ | USP2 | O75604 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4333787 | 0.96 | TDP1 (0.68) | TDP1HSD17B10USP2ALDH1A1 | |
| SCHEMBL3374190 | 0.92 | TDP1 (0.71) | TDP1HSD17B10USP2HTT | |
| SCHEMBL4326588 | 0.89 | TDP1 (0.53) | TDP1HSD17B10USP2ALDH1A1HTT | |
| SCHEMBL55747 | 0.89 | TDP1 (0.72) | TDP1HSD17B10USP2HTT | |
| 2-Ethoxyethanol SCHEMBL203033 | 0.89 | ALDH1A1 (0.52) | TDP1HSD17B10USP2ALDH1A1HTT | |
| Ether SCHEMBL5183492 | 0.88 | TDP1 (0.53) | TDP1HSD17B10USP2ALDH1A1 | |
| SCHEMBL29085587 | 0.88 | TDP1 (0.51) | TDP1HSD17B10USP2HTT | |
| SCHEMBL27876026 | 0.87 | TDP1 (0.70) | TDP1HSD17B10USP2HTT | |
| SCHEMBL15970082 | 0.86 | USP2 (0.53) | TDP1HSD17B10USP2HTT | |
| SCHEMBL4321410 | 0.86 | TDP1 (0.54) | TDP1HSD17B10USP2ALDH1A1HTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4012726-B1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12152169-B2 | Adhesive conductive paste | DAICEL CORPORATION (JP) | 2024-11-26 | — | — | US | disclosed |
| WO-2024219382-A1 | LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| US-20220275247-A1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| EP-4012726-A1 | ADHESIVE CONDUCTIVE PASTE | Daicel Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| CN-114270453-A | Adhesive conductor paste | 株式会社大赛璐 | 2022-04-01 | — | — | CN | disclosed |
| US-20210114967-A1 | RESIST COMPOSITION FOR PATTERN PRINTING AND PATTERN FORMING METHOD | KANEKA CORPORATION (JP) | 2021-04-22 | — | — | US | disclosed |
| EP-3806593-A1 | RESIST COMPOSITION FOR PATTERN PRINTING USE, AND METHOD FOR MANUFACTURING CIRCUIT PATTERN USING SAME | KANEKA CORPORATION (JP) | 2021-04-14 | — | — | EP | disclosed |
| US-20210103216-A1 | RESIST COMPOSITION FOR PATTERN PRINTING, AND PRODUCTION METHOD OF CIRCUIT PATTERNS USING THE SAME | KANEKA CORPORATION (JP) | 2021-04-08 | — | — | US | disclosed |
| CN-110724604-A | Water-based environment-friendly neutral cleaning solution | 华璞微电子科技(宁波)有限公司 | 2020-01-24 | — | — | CN | disclosed |
| CN-101738859-A | Photosensitive resin composition and display | SUMITOMO CHEMICAL CO | 2010-06-16 | — | — | CN | disclosed |
| CN-1957299-B | Radiation-sensitive composition, multilayer body and method for producing same, and electronic component | ZEON CORP | 2010-04-21 | — | — | CN | disclosed |
| US-20090324831-A1 | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| CN-101490170-A | Curable resin composition and method for forming cured coating film | DAICEL CHEM (JP) | 2009-07-22 | — | — | CN | disclosed |
| EP-2048196-A1 | CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM | Daicel Chemical Industries, Ltd. (JP) | 2009-04-15 | — | — | EP | disclosed |
| CN-101398498-A | Coloring composite for color filter, color filter, and displaying device for color filter | FUJIFILM CORP (JP) | 2009-04-01 | — | — | CN | disclosed |
| CN-1957299-A | Radiation-sensitive composition, multilayer body and method for producing same, and electronic component | ZEON CORP (JP) | 2007-05-02 | — | — | CN | disclosed |
| CN-1664707-A | Scouring agent and flushing fluid for the planography | DAICEL CHEM (JP) | 2005-09-07 | — | — | CN | disclosed |
| CN-1163476-C | Biuret polyisocyanic acid ester and its producing process | 旭化成株式会社 | 2004-08-25 | — | — | CN | disclosed |
| CN-1335302-A | Biuret polyisocyanic acid ester and its producing process | ASAHI CHEMICAL IND (JP) | 2002-02-13 | — | — | CN | disclosed |