Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.68 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.52 |
| ▸ | USP2 | O75604 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4327463 | 0.96 | TDP1 (0.67) | TDP1HSD17B10USP2ALDH1A1 | |
| SCHEMBL55747 | 0.93 | TDP1 (0.72) | TDP1HSD17B10USP2 | |
| SCHEMBL4321410 | 0.90 | TDP1 (0.54) | TDP1HSD17B10USP2ALDH1A1 | |
| 2-Ethoxyethanol SCHEMBL7529858 | 0.90 | TDP1 (0.53) | TDP1HSD17B10ALDH1A1 | |
| Ether SCHEMBL55521 | 0.89 | TDP1 (0.55) | TDP1HSD17B10ALDH1A1 | |
| SCHEMBL3374190 | 0.89 | TDP1 (0.71) | TDP1HSD17B10USP2 | |
| Ether SCHEMBL8930257 | 0.89 | TDP1 (0.57) | TDP1HSD17B10USP2 | |
| SCHEMBL25304777 | 0.87 | TDP1 (0.63) | TDP1HSD17B10USP2 | |
| SCHEMBL28718273 | 0.87 | TDP1 (0.50) | TDP1HSD17B10ALDH1A1 | |
| SCHEMBL4317251 | 0.87 | TDP1 (0.64) | TDP1HSD17B10USP2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4012726-B1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12152169-B2 | Adhesive conductive paste | DAICEL CORPORATION (JP) | 2024-11-26 | — | — | US | disclosed |
| WO-2024219382-A1 | LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| US-20220275247-A1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| EP-4012726-A1 | ADHESIVE CONDUCTIVE PASTE | Daicel Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| CN-114270453-A | Adhesive conductor paste | 株式会社大赛璐 | 2022-04-01 | — | — | CN | disclosed |
| CN-101738863-B | Photosensitive resin composition and display | SUMITOMO CHEMICAL CO | 2015-01-07 | — | — | CN | disclosed |
| CN-1664707-B | Scouring agent and flushing fluid for the planography | DAICEL CHEM | 2011-09-14 | — | — | CN | disclosed |
| CN-101738863-A | Photosensitive resin composition and display | SUMITOMO CHEMICAL CO | 2010-06-16 | — | — | CN | disclosed |
| US-20090324831-A1 | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| CN-101490170-A | Curable resin composition and method for forming cured coating film | DAICEL CHEM (JP) | 2009-07-22 | — | — | CN | disclosed |
| EP-2048196-A1 | CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM | Daicel Chemical Industries, Ltd. (JP) | 2009-04-15 | — | — | EP | disclosed |
| CN-101398498-A | Coloring composite for color filter, color filter, and displaying device for color filter | FUJIFILM CORP (JP) | 2009-04-01 | — | — | CN | disclosed |
| CN-1664707-A | Scouring agent and flushing fluid for the planography | DAICEL CHEM (JP) | 2005-09-07 | — | — | CN | disclosed |