Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.49 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4327461 | 0.93 | TDP1 (0.41) | TDP1HSD17B10LMNA | |
| SCHEMBL4321415 | 0.90 | TDP1 (0.46) | TDP1HSD17B10LMNA | |
| SCHEMBL4314541 | 0.86 | TDP1 (0.49) | TDP1HSD17B10 | |
| SCHEMBL7044264 | 0.85 | TDP1 (0.53) | TDP1HSD17B10LMNA | |
| SCHEMBL4326586 | 0.82 | TDP1 (0.39) | TDP1HSD17B10LMNA | |
| SCHEMBL1156854 | 0.80 | TDP1 (0.53) | TDP1HSD17B10LMNA | |
| SCHEMBL5158944 | 0.80 | TDP1 (0.53) | TDP1HSD17B10 | |
| SCHEMBL15970081 | 0.79 | MAPT (0.41) | TDP1HSD17B10LMNA | |
| SCHEMBL2265097 | 0.79 | TDP1 (0.61) | TDP1HSD17B10 | |
| SCHEMBL2267733 | 0.79 | TDP1 (0.61) | TDP1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4012726-B1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12152169-B2 | Adhesive conductive paste | DAICEL CORPORATION (JP) | 2024-11-26 | — | — | US | disclosed |
| WO-2024219382-A1 | LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| US-20220275247-A1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| EP-4012726-A1 | ADHESIVE CONDUCTIVE PASTE | Daicel Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| CN-114270453-A | Adhesive conductor paste | 株式会社大赛璐 | 2022-04-01 | — | — | CN | disclosed |
| CN-101738863-B | Photosensitive resin composition and display | SUMITOMO CHEMICAL CO | 2015-01-07 | — | — | CN | disclosed |
| CN-1664707-B | Scouring agent and flushing fluid for the planography | DAICEL CHEM | 2011-09-14 | — | — | CN | disclosed |
| CN-101738863-A | Photosensitive resin composition and display | SUMITOMO CHEMICAL CO | 2010-06-16 | — | — | CN | disclosed |
| US-20090324831-A1 | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| CN-101490170-A | Curable resin composition and method for forming cured coating film | DAICEL CHEM (JP) | 2009-07-22 | — | — | CN | disclosed |
| EP-2048196-A1 | CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM | Daicel Chemical Industries, Ltd. (JP) | 2009-04-15 | — | — | EP | disclosed |
| CN-101398498-A | Coloring composite for color filter, color filter, and displaying device for color filter | FUJIFILM CORP (JP) | 2009-04-01 | — | — | CN | disclosed |
| CN-1664707-A | Scouring agent and flushing fluid for the planography | DAICEL CHEM (JP) | 2005-09-07 | — | — | CN | disclosed |