SCHEMBL4327461

SCHEMBL4327461

CCCC(OCC)C(C)OCC(C)O

nearest known ligand 0.41

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.41
HSD17B10 Q99714 1/20 0.39
LMNA P02545 1/20 0.37
MAPK1 P28482 1/20 0.31
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4333790 0.93 TDP1 (0.49) TDP1HSD17B10LMNA
SCHEMBL4326586 0.89 TDP1 (0.39) TDP1HSD17B10LMNAMAPT
SCHEMBL15970081 0.85 MAPT (0.41) TDP1HSD17B10LMNAMAPT
SCHEMBL28115141 0.85 LMNA (0.50) LMNA
SCHEMBL10277506 0.84 TDP1 (0.41) TDP1HSD17B10MAPK1MAPT
SCHEMBL4321415 0.83 TDP1 (0.46) TDP1HSD17B10LMNAMAPT
SCHEMBL2220557 0.83 TDP1 (0.45) TDP1HSD17B10LMNAMAPK1MAPT
SCHEMBL4314541 0.78 TDP1 (0.49) TDP1HSD17B10
SCHEMBL6437780 0.77 TDP1 (0.45) TDP1HSD17B10LMNAMAPK1MAPT
SCHEMBL16933903 0.77 TDP1 (0.45) TDP1HSD17B10LMNAMAPK1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4012726-B1 ADHESIVE CONDUCTIVE PASTE DAICEL CORP (JP) 2025-10-22 EP disclosed
US-12152169-B2 Adhesive conductive paste DAICEL CORPORATION (JP) 2024-11-26 US disclosed
WO-2024219382-A1 LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE 株式会社ダイセル 2024-10-24 WO disclosed
US-20220275247-A1 ADHESIVE CONDUCTIVE PASTE DAICEL CORPORATION (JP) 2022-09-01 US disclosed
EP-4012726-A1 ADHESIVE CONDUCTIVE PASTE Daicel Corporation (JP) 2022-06-15 EP disclosed
CN-114270453-A Adhesive conductor paste 株式会社大赛璐 2022-04-01 CN disclosed
US-20210114967-A1 RESIST COMPOSITION FOR PATTERN PRINTING AND PATTERN FORMING METHOD KANEKA CORPORATION (JP) 2021-04-22 US disclosed
EP-3806593-A1 RESIST COMPOSITION FOR PATTERN PRINTING USE, AND METHOD FOR MANUFACTURING CIRCUIT PATTERN USING SAME KANEKA CORPORATION (JP) 2021-04-14 EP disclosed
US-20210103216-A1 RESIST COMPOSITION FOR PATTERN PRINTING, AND PRODUCTION METHOD OF CIRCUIT PATTERNS USING THE SAME KANEKA CORPORATION (JP) 2021-04-08 US disclosed
CN-110724604-A Water-based environment-friendly neutral cleaning solution 华璞微电子科技(宁波)有限公司 2020-01-24 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
CN-1664707-B Scouring agent and flushing fluid for the planography DAICEL CHEM 2011-09-14 CN disclosed
CN-101738859-A Photosensitive resin composition and display SUMITOMO CHEMICAL CO 2010-06-16 CN disclosed
CN-1957299-B Radiation-sensitive composition, multilayer body and method for producing same, and electronic component ZEON CORP 2010-04-21 CN disclosed
US-20090324831-A1 CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-31 US disclosed
CN-101490170-A Curable resin composition and method for forming cured coating film DAICEL CHEM (JP) 2009-07-22 CN disclosed
EP-2048196-A1 CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM Daicel Chemical Industries, Ltd. (JP) 2009-04-15 EP disclosed
CN-101398498-A Coloring composite for color filter, color filter, and displaying device for color filter FUJIFILM CORP (JP) 2009-04-01 CN disclosed
CN-1957299-A Radiation-sensitive composition, multilayer body and method for producing same, and electronic component ZEON CORP (JP) 2007-05-02 CN disclosed
CN-1664707-A Scouring agent and flushing fluid for the planography DAICEL CHEM (JP) 2005-09-07 CN disclosed