Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10277506 | 0.93 | TDP1 (0.41) | TDP1HSD17B10 | |
| SCHEMBL429420 | 0.90 | TDP1 (0.46) | TDP1HSD17B10 | |
| SCHEMBL426341 | 0.90 | TDP1 (0.46) | TDP1HSD17B10 | |
| SCHEMBL423768 | 0.87 | TDP1 (0.44) | TDP1HSD17B10 | |
| SCHEMBL429771 | 0.87 | TDP1 (0.44) | TDP1HSD17B10 | |
| SCHEMBL4333790 | 0.86 | TDP1 (0.49) | TDP1HSD17B10 | |
| SCHEMBL15387104 | 0.86 | TDP1 (0.47) | TDP1HSD17B10 | |
| SCHEMBL428361 | 0.86 | TDP1 (0.47) | TDP1HSD17B10 | |
| SCHEMBL432085 | 0.82 | TDP1 (0.39) | TDP1HSD17B10 | |
| SCHEMBL17654662 | 0.82 | TDP1 (0.38) | TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4012726-B1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-12152169-B2 | Adhesive conductive paste | DAICEL CORPORATION (JP) | 2024-11-26 | — | — | US | disclosed |
| WO-2024219382-A1 | LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE | 株式会社ダイセル | 2024-10-24 | — | — | WO | disclosed |
| US-20220275247-A1 | ADHESIVE CONDUCTIVE PASTE | DAICEL CORPORATION (JP) | 2022-09-01 | — | — | US | disclosed |
| EP-4012726-A1 | ADHESIVE CONDUCTIVE PASTE | Daicel Corporation (JP) | 2022-06-15 | — | — | EP | disclosed |
| CN-114270453-A | Adhesive conductor paste | 株式会社大赛璐 | 2022-04-01 | — | — | CN | disclosed |
| US-20090324831-A1 | CURABLE RESIN COMPOSITION AND PROCESS FOR PRODUCING CURED COATING USING THE SAME | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| EP-2048196-A1 | CURABLE RESIN COMPOSITION AND METHOD FOR FORMING CURED COATING FILM | Daicel Chemical Industries, Ltd. (JP) | 2009-04-15 | — | — | EP | disclosed |