SCHEMBL433429

SCHEMBL433429

C=CCc1cccc(C=C)c1O

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 2/20 0.66
GABRB2 P47870 2/20 0.66
KMT2A Q03164 7/20 0.56
MEN1 O00255 6/20 0.56
LMNA P02545 4/20 0.56
ALDH1A1 P00352 2/20 0.56
AKR1B1 P15121 1/20 0.54
MAPT P10636 6/20 0.52
GAA P10253 4/20 0.52
KDM4E B2RXH2 3/20 0.52
CASP1 P29466 1/20 0.52
HSD17B10 Q99714 1/20 0.52
ALOX12 P18054 2/20 0.51
MAPK1 P28482 2/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
HTT P42858 3/20 0.47
NPC1 O15118 1/20 0.47
POLB P06746 1/20 0.47
RAB9A P51151 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10041813 0.86 GABRA1 (0.63) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL168974 0.85 GABRA1 (0.79) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL29952629 0.85 GABRA1 (0.61) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL617923 0.85 GABRA1 (0.61) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL9014124 0.83 GABRA1 (0.59) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL6823137 0.82 KMT2A (0.62) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL7171833 0.82 KMT2A (0.62) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL9013928 0.82 GABRA1 (0.58) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL14433461 0.82 GABRA1 (0.58) GABRA1GABRB2KMT2AMEN1LMNA
SCHEMBL10071685 0.80 KMT2A (0.61) GABRA1GABRB2KMT2AMEN1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023203827-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR株式会社 2023-10-26 WO disclosed
US-9643960-B2 Procaspase activating compounds THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS (US) 2017-05-09 US disclosed
US-9102661-B2 Design, synthesis and evaluation of procaspase activating compounds as personalized anti-cancer drugs THE BOARD OF TRUSTEES OF THE UNIVERSITY ILLINOIS (US) 2015-08-11 US disclosed
US-8859187-B2 Method of forming resist pattern and negative resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2014-10-14 US disclosed
EP-1895576-B1 PATTERN FORMING METHOD TOKYO OHKA KOGYO CO LTD (JP) 2014-07-23 EP disclosed
US-8349543-B2 Pattern-forming method, metal oxide film-forming material and method for using the metal oxide film-forming material TOKYO OHKA KOGYO CO. LTD. (JP) 2013-01-08 US disclosed
US-8263322-B2 Method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-09-11 US disclosed
US-8124312-B2 Method for forming pattern, and material for forming coating film TOKYO OHKA KOGYO CO., LTD. (JP) 2012-02-28 US disclosed
US-8101013-B2 Film-forming material and method of forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-01-24 US disclosed
US-8025923-B2 Method for manufacturing a structure TOKYO OHKA KOGYO CO., LTD. (JP) 2011-09-27 US disclosed
US-20100035177-A1 METHOD FOR FORMING PATTERN, AND MATERIAL FOR FORMING COATING FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2010-02-11 US disclosed
US-20100003622-A1 PATTERN-FORMING METHOD, METAL OXIDE FILM-FORMING MATERIAL AND METHOD FOR USING THE METAL OXIDE FILM-FORMING MATERIAL Tokyo Ohka Kogy Co., Ltd (JP) 2010-01-07 US disclosed
US-20090191478-A1 METHOD OF FORMING RESIST PATTERN AND NEGATIVE RESIST COMPOSITION TOKYO OHKA KOGYO CO., LTD (JP) 2009-07-30 US disclosed
US-20090134119-A1 FILM-FORMING MATERIAL AND METHOD OF FORMING PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-05-28 US disclosed
US-20090087625-A1 METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURE TOKYO OHKA KOGYO CO., LTD. (JP) 2009-04-02 US disclosed
US-20090061170-A1 ANISOTROPIC FILM AND METHOD OF MANUFACTURING ANISOTROPIC FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-05 US disclosed
US-20090029284-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-01-29 US disclosed
EP-1895576-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2008-03-05 EP disclosed
US-5529886-A PHOTOSENSITIVE MIXTURE OF A COMPOUND WHICH ON EXPOSURE TO ACTINIC RADIATION FORMS ACID, AND AN ACID-CLEAVABLE ACRYLATE HOMO OR COPOLYMER HOECHST AKTIENGESELLSCHAFT (DE) 1996-06-25 US disclosed
US-5442087-A Preparing offset printing plates and photoresists HOECHST AKTIENGESELLSCHAFT (DE) 1995-08-15 US disclosed