SCHEMBL4337181

SCHEMBL4337181

COc1ccc(S(=O)(=O)OC2CCCCC2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.52
KDM4E B2RXH2 2/20 0.50
GAA P10253 1/20 0.50
HTT P42858 2/20 0.49
PKM P14618 2/20 0.48
ALDH1A1 P00352 2/20 0.47
CYP2D6 P10635 2/20 0.47
CYP2C19 P33261 1/20 0.47
MAPT P10636 1/20 0.47
SMN1; SMN2 Q16637 1/20 0.47
POLB P06746 1/20 0.46
MMP13 P45452 4/20 0.46
MMP1 P03956 3/20 0.46
MMP8 P22894 1/20 0.46
MMP3 P08254 2/20 0.45
MMP7 P09237 2/20 0.45
NPC1 O15118 1/20 0.45
PKLR P30613 1/20 0.45
RAB9A P51151 1/20 0.45
CNR1 P21554 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16712204 0.91 NAAA (0.56) NAAAGAAHTTPKMALDH1A1
SCHEMBL11107669 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL22621292 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL361129 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL23192021 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL24250706 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL9060935 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL8370244 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL8367865 0.83 CYP2D6 (0.61) KDM4EGAAALDH1A1CYP2D6CYP2C19
SCHEMBL777214 0.81 CYP2D6 (0.63) GAAHTTPKMALDH1A1CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101065445-B Thermosetting resin composition, thermosetting-resin molding material, and cured object obtained therefrom SUMITOMO BAKELITE CO 2011-05-11 CN claimed
EP-1163550-B1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY FUJIFILM ELECTRONIC MATERIALS (US) 2007-05-30 EP claimed
EP-1163550-A4 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY ARCH SPEC CHEM INC (US) 2004-05-26 EP claimed
US-20020007018-A1 Hydroxy-amino thermally cured undercoat for 193 nm lithography ARCH SPECIALTY CHEMICALS, INC. 2002-01-17 US claimed
EP-1163550-A1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY Arch Specialty Chemicals, Inc. (US) 2001-12-19 EP claimed
US-6323287-B1 USEFUL FOR AN UNDERCOAT LAYER IN DEEP ULTRAVILOLET RADIATION LITHOGRAPHY; FOR CHEMICALLY AMPLIFIED BILAYER RESIST SYSTEMS; SEMICONDUCTORS ARCH SPECIALTY CHEMICALS, INC. 2001-11-27 US claimed
WO-2000054105-A1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY ARCH SPECIALTY CHEMICALS, INC. (US) 2000-09-14 WO claimed
CN-108697595-A Interior silica containing microcapsule resin particle, its production method and application thereof 积水化成品工业株式会社 2018-10-23 CN disclosed
CN-101296952-B Anti-reflective coatings AZ ELECTRONIC MATERIALS USA 2014-03-26 CN disclosed
EP-1634916-B1 Hydroxy-amino thermally cured undercoat for 193 NM lithography FUJIFILM ELECTRONIC MATERIALS (US) 2009-01-21 EP disclosed
CN-101296952-A Anti-reflective coatings AZ ELECTRONIC MATERIALS USA (US) 2008-10-29 CN disclosed
EP-1163550-B1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY FUJIFILM ELECTRONIC MATERIALS (US) 2007-05-30 EP disclosed
US-7217497-B2 Hydroxy-amino thermally cured undercoat for 193 nm lithography ARCH SPECIALTY CHEMICALS, INC. (US) 2007-05-15 US disclosed
US-6610808-B2 Thermally cured underlayer for lithographic application ARCH SPECIALTY CHEMICALS, INC. 2003-08-26 US disclosed
US-20020173594-A1 Thermally cured underlayer for lithographic application ARCH SPECIALTY CHEMICALS, INC. (US) 2002-11-21 US disclosed
WO-2002073307-A2 THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION ARCH SPECIALTY CHEMICALS, INC. (US) 2002-09-19 WO disclosed
US-20020007018-A1 Hydroxy-amino thermally cured undercoat for 193 nm lithography ARCH SPECIALTY CHEMICALS, INC. 2002-01-17 US disclosed
EP-1163550-A1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY Arch Specialty Chemicals, Inc. (US) 2001-12-19 EP disclosed
US-6323287-B1 USEFUL FOR AN UNDERCOAT LAYER IN DEEP ULTRAVILOLET RADIATION LITHOGRAPHY; FOR CHEMICALLY AMPLIFIED BILAYER RESIST SYSTEMS; SEMICONDUCTORS ARCH SPECIALTY CHEMICALS, INC. 2001-11-27 US disclosed
WO-2000054105-A1 HYDROXY-AMINO THERMALLY CURED UNDERCOAT FOR 193 NM LITHOGRAPHY ARCH SPECIALTY CHEMICALS, INC. (US) 2000-09-14 WO disclosed