SCHEMBL4348247

SCHEMBL4348247

CCc1cc(-c2ccccc2)oc1-c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.50
POLB P06746 1/20 0.50
PDE4A P27815 2/20 0.49
CYP3A4 P08684 4/20 0.41
HPGD P15428 4/20 0.41
TP53 P04637 3/20 0.41
KMT2A Q03164 2/20 0.41
AR P10275 2/20 0.41
GABRP O00591 1/20 0.41
GABRD O14764 1/20 0.41
NPC1 O15118 1/20 0.41
CA12 O43570 1/20 0.41
TNKS O95271 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
ABCB1 P08183 1/20 0.41
PARP1 P09874 1/20 0.41
ADORA3 P0DMS8 1/20 0.41
CYP19A1 P11511 1/20 0.41
GABRA1 P14867 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12603818 0.81 MAOB (0.43) KDM4ECYP3A4HPGDTP53KMT2A
SCHEMBL14848497 0.77 ALDH1A1 (0.44) KDM4ECYP3A4HPGDTP53KMT2A
SCHEMBL23940764 0.75 HPGD (0.42) KDM4EPOLBCYP3A4HPGDTP53
SCHEMBL10205941 0.74 MAOB (0.52) KDM4EPOLBPDE4ACYP3A4HPGD
SCHEMBL3098671 0.73 ALDH1A1 (0.44) KDM4EPOLBCYP3A4HPGDTP53
SCHEMBL7049549 0.72 MAOB (0.42) KDM4ECYP3A4HPGDTP53KMT2A
SCHEMBL29858672 0.71 ALDH1A1 (0.59) KDM4EPDE4ACYP3A4HPGDKMT2A
SCHEMBL11462813 0.70 PDE4A (0.68) KDM4EPOLBPDE4ACYP3A4HPGD
SCHEMBL23447590 0.69 KDM4E (0.50) KDM4EPOLBPDE4ACYP3A4HPGD
SCHEMBL7676627 0.69 KMT2A (0.58) KDM4EPOLBPDE4ACYP3A4HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7611818-B2 Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-11-03 US claimed
CN-101980082-B Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board HITACHI CHEMICAL CO LTD 2013-07-17 CN disclosed
CN-1879060-B Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2011-09-28 CN disclosed
CN-101980082-A Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board HITACHI CHEMICAL CO LTD 2011-02-23 CN disclosed
US-7611818-B2 Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-11-03 US disclosed
US-20070077514-A1 Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-04-05 US disclosed
CN-1879060-A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD (JP) 2006-12-13 CN disclosed
US-4220708-A Photochromic compounds GEC-MARONI LIMITED (GB) 1980-09-02 US disclosed