SCHEMBL4353686

SCHEMBL4353686

CCC/C=C/[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4353689 1.00
SCHEMBL3082951 0.86 TSHR (0.33)
SCHEMBL3082948 0.86 TSHR (0.33)
SCHEMBL4354197 0.84 FAAH (0.40)
SCHEMBL4354195 0.84 FAAH (0.40)
SCHEMBL4365366 0.82 FAAH (0.43)
SCHEMBL4365363 0.82 FAAH (0.43)
SCHEMBL4349949 0.82 FAAH (0.43)
SCHEMBL4366313 0.82 FAAH (0.43)
SCHEMBL4366312 0.82 FAAH (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140102332-A1 FUNCTIONAL REINFORCING FILLERS MODIFIED WITH ALKENYLALKOXYSILANE AND PREPARING METHOD OF THE SAME KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2014-04-17 US claimed
WO-2020196644-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER デンカ株式会社 2020-10-01 WO disclosed
US-9127167-B2 Functional reinforcing fillers modified with alkenylalkoxysilane and preparing method of the same KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2015-09-08 US disclosed
US-20140102332-A1 FUNCTIONAL REINFORCING FILLERS MODIFIED WITH ALKENYLALKOXYSILANE AND PREPARING METHOD OF THE SAME KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2014-04-17 US disclosed
EP-1989253-B1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2013-10-02 EP disclosed
EP-2024439-B1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2012-06-27 EP disclosed
US-20090298980-A1 Curable Silicone Resin Composition and Cured Body Thereof DOW CORNING TORAY CO., LTD. (JP) 2009-12-03 US disclosed
US-20090099321-A1 Curable Silicone Resin Composition and Cured Body Thereof DOW CORNING TORAY COMPANY, LTD. (JP) 2009-04-16 US disclosed
EP-2024439-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF Dow Corning Toray Co., Ltd. (JP) 2009-02-18 EP disclosed
EP-1989253-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF Dow Corning Toray Co., Ltd. (JP) 2008-11-12 EP disclosed
WO-2007132932-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO., LTD. (JP) 2007-11-22 WO disclosed
WO-2007099863-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO., LTD. (JP) 2007-09-07 WO disclosed
US-7015292-B2 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2006-03-21 US disclosed
US-20050038214-A1 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2005-02-17 US disclosed
WO-2004005404-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT DOW CORNING TORAY SILICONE CO.,LTD. (JP) 2004-01-15 WO disclosed
EP-0586241-B1 Azasilacycloalkyl functional alkoxysilanes and azasilacycloalkyl functional tetramethyldisiloxanes DOW CORNING (US) 1997-04-09 EP disclosed
EP-0586240-B1 Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom DOW CORNING (US) 1996-12-18 EP disclosed
EP-0586240-A2 Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom DOW CORNING CORPORATION (US) 1994-03-09 EP disclosed
US-5276123-A Endblocking polysiloxanes DOW CORNING CORPORATION (US) 1994-01-04 US disclosed
US-5239099-A Room temperature vulcanization; noncorrosive byproducts DOW CORNING CORPORATION (US) 1993-08-24 US disclosed