SCHEMBL4354536

SCHEMBL4354536

CO[Si](CCCOCCCn1ccnc1)(OC)OC

nearest known ligand 0.55

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.55
MEN1 O00255 3/20 0.55
ATM Q13315 1/20 0.55
TBXAS1 P24557 2/20 0.50
QPCT Q16769 1/20 0.49
ALDH1A1 P00352 2/20 0.46
TP53 P04637 1/20 0.46
GAA P10253 1/20 0.46
MAPK1 P28482 1/20 0.46
HSD17B10 Q99714 1/20 0.46
HTT P42858 1/20 0.46
POLB P06746 1/20 0.46
KDM4E B2RXH2 2/20 0.45
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL406663 0.89 TBXAS1 (0.59) KMT2AMEN1ATMTBXAS1QPCT
Hydrochloric Acid SCHEMBL27901082 0.87 TBXAS1 (0.57) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL21141580 0.82 TBXAS1 (0.55) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL12802207 0.81 TBXAS1 (0.52) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL23071645 0.80 TBXAS1 (0.49) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL22472280 0.80 QPCT (0.51) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL27963021 0.80 TBXAS1 (0.68) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL8387191 0.78 TBXAS1 (0.59) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL16312376 0.78 TBXAS1 (0.51) KMT2AMEN1ATMTBXAS1QPCT
SCHEMBL762532 0.78 TBXAS1 (0.63) KMT2AMEN1ATMTBXAS1QPCT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed