SCHEMBL4355709

SCHEMBL4355709

O=C1OC(=O)c2ccc(cc2C(=O)O)C(=O)c2cccc1c2

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TYMS P04818 1/20 0.46
ACMSD Q8TDX5 5/20 0.45
FOLH1 Q04609 3/20 0.42
MCL1 Q07820 3/20 0.40
HNF4A P41235 3/20 0.40
DHFR P00374 1/20 0.40
HSD17B10 Q99714 1/20 0.40
CA12 O43570 3/20 0.39
CA7 P43166 3/20 0.39
CA1 P00915 2/20 0.39
CA4 P22748 1/20 0.39
PTPN1 P18031 1/20 0.38
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
XDH P47989 1/20 0.36
SLC22A12 Q96S37 1/20 0.36
POLB P06746 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29024086 0.83 TYMS (0.47) TYMSACMSDFOLH1MCL1HNF4A
SCHEMBL31528304 0.82 HSD17B10 (0.43) TYMSACMSDFOLH1MCL1HNF4A
SCHEMBL2188108 0.81 TYMS (0.49) TYMSACMSDMCL1HNF4ADHFR
SCHEMBL1245664 0.78 TYMS (0.50) TYMSACMSDMCL1HNF4ADHFR
SCHEMBL31506399 0.78 SRD5A1 (0.48) TYMSACMSDFOLH1MCL1CA12
SCHEMBL11863723 0.78 TYMS (0.45) TYMSACMSDFOLH1MCL1HNF4A
SCHEMBL21173954 0.77 CA12 (0.41) TYMSCA12CA1PTPN1CA2
SCHEMBL31520121 0.77 FOLH1 (0.44) TYMSACMSDFOLH1MCL1HNF4A
SCHEMBL538529 0.76 TYMS (0.50) TYMSACMSDFOLH1MCL1HNF4A
SCHEMBL9401829 0.75 TYMS (0.37) TYMSFOLH1CA12CA7CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090277666-A1 HEAT-RESISTANT RESIN VARNISH, HEAT-RESISTANT RESIN FILMS, HEAT-RESISTANT RESIN COMPOSITES, AND INSULATED WIRE SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 2009-11-12 US disclosed
US-5342739-A Coating a substrate with a polyamic acid modified by an amino- or hydroxy-substituted phenol; shelf life CHISSO CORPORATION (JP) 1994-08-30 US disclosed
EP-0526650-A1 PHOTOSENSITIVE POLYMER COMPOSITION AND PATTERN FORMATION CHISSO CORPORATION (JP) 1993-02-10 EP disclosed
US-4321319-A Photosensitive compositions containing polyamides acid with photosensitive groups HITACHI, LTD. (JP) 1982-03-23 US disclosed
EP-0020773-A1 LIGHT-SENSITIVE POLYMER COMPOSITION Hitachi, Ltd. (JP) 1981-01-07 EP disclosed
US-4058503-A FROM AN ANHYDRIDE AND A DIHYDRAZIDE BRIDGESTONE TIRE COMPANY LIMITED (JA) 1977-11-15 US disclosed
US-3960980-A Method of producing elastomer resins BRIDGESTONE TIRE COMPANY LIMITED (JA) 1976-06-01 US disclosed