Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC9A1 | P19634 | 7/20 | 0.43 |
| ▸ | PLA2G4A | P47712 | 1/20 | 0.37 |
| ▸ | CYP4Z1 | Q86W10 | 5/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 3/20 | 0.34 |
| ▸ | NPC1 | O15118 | 2/20 | 0.34 |
| ▸ | MGAM | O43451 | 1/20 | 0.33 |
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | SI | P14410 | 1/20 | 0.33 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3275196 | 0.85 | SLC9A1 (0.55) | SLC9A1CYP4Z1MEN1KMT2ALMNA | |
| SCHEMBL238663 | 0.85 | SLC9A1 (0.55) | SLC9A1CYP4Z1MEN1KMT2ALMNA | |
| Benzotriazole SCHEMBL20913175 | 0.79 | SLC9A1 (0.45) | SLC9A1PLA2G4ACYP4Z1MEN1KMT2A | |
| SCHEMBL909899 | 0.79 | SLC9A1 (0.59) | SLC9A1CYP4Z1MEN1KMT2ALMNA | |
| SCHEMBL8615252 | 0.79 | ALDH1A1 (0.36) | LMNAL3MBTL1 | |
| SCHEMBL28386068 | 0.78 | SLC9A1 (0.53) | SLC9A1CYP4Z1MEN1KMT2ALMNA | |
| SCHEMBL9128799 | 0.78 | SLC9A1 (0.53) | SLC9A1CYP4Z1MEN1KMT2ALMNA | |
| SCHEMBL5666614 | 0.76 | SLC9A1 (0.44) | SLC9A1PLA2G4ACYP4Z1MEN1KMT2A | |
| SCHEMBL4209555 | 0.75 | SLC9A1 (0.46) | SLC9A1PLA2G4ACYP4Z1MEN1KMT2A | |
| SCHEMBL31702792 | 0.73 | SLC9A1 (0.61) | SLC9A1CYP4Z1LMNARAB9ANPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107406752-B | Polishing agent, stock solution for polishing agent, and polishing method | 日立化成株式会社 | 2020-05-08 | — | — | CN | claimed |
| US-20070128872-A1 | Polishing composition and polishing method | SHOWA DENKO K.K. (JP) | 2007-06-07 | — | — | US | claimed |
| EP-1687387-A1 | POLISHING COMPOSITION COMPRISING PHOSPHATE ESTERS AND POLISHING METHOD | Showa Denko K.K. (JP) | 2006-08-09 | — | — | EP | claimed |
| WO-2005047409-A1 | POLISHING COMPOSITION AND POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2005-05-26 | — | — | WO | claimed |
| US-20240191362-A1 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| US-20240191360-A1 | CHEMICAL SOLUTION FOR REMOVING PRECIOUS METAL, METHOD FOR MANUFACTURING CHEMICAL SOLUTION, METHOD FOR TREATING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-06-13 | — | — | US | disclosed |
| EP-4379780-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| EP-4379779-A1 | POLISHING SOLUTION, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| WO-2024095926-A1 | CLEANING LIQUID AND SUBSTRATE CLEANING METHOD | 東京応化工業株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20240101936-A1 | AQUEOUS CLEANING LIQUID AND METHOD OF CLEANING ELECTRONIC DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-03-28 | — | — | US | disclosed |
| EP-4339254-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| US-20230314955-A1 | PHOTORESIST STRIPPER AND METHOD OF TREATING SUBSTRATE USING SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-05 | — | — | US | disclosed |
| WO-2003104350-A1 | METAL POLISH COMPOSITION, POLISHING METHOD USING THE COMPOSITION AND METHOD FOR PRODUCING WAFER USING THE POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2003-12-18 | — | — | WO | disclosed |
| US-20030219982-A1 | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method | HITACHI CHEMICAL CO., LTD (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20030186497-A1 | Methods of polishing, interconnect-fabrication, and producing semiconductor devices | HITACHI, LTD. | 2003-10-02 | — | — | US | disclosed |
| US-6562719-B2 | Methods of polishing, interconnect-fabrication, and producing semiconductor devices | HITACHI, LTD. (JP) | 2003-05-13 | — | — | US | disclosed |
| EP-1223609-A1 | POLISHING COMPOUND FOR CHEMIMECHANICAL POLISHING AND POLISHING METHOD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| US-20020017630-A1 | Abrasive liquid for metal and method for polishing | RENESAS ELECTRONICS CORPORATION (JP) | 2002-02-14 | — | — | US | disclosed |
| US-20020016073-A1 | Methods of polishing, interconnect-fabrication, and producing semiconductor devices | HITACHI, LTD. | 2002-02-07 | — | — | US | disclosed |
| EP-1137056-A1 | ABRASIVE LIQUID FOR METAL AND METHOD FOR POLISHING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |