SCHEMBL4353034

SCHEMBL4353034

CC(C)n1ncc(C#N)c1CC(=O)O

nearest known ligand 0.37

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.37
XDH P47989 2/20 0.34
PTGS1 P23219 1/20 0.34
PTGS2 P35354 1/20 0.34
KDM4E B2RXH2 3/20 0.33
ALDH1A1 P00352 1/20 0.33
HPGD P15428 1/20 0.33
HSD17B10 Q99714 1/20 0.33
HTT P42858 1/20 0.32
RECQL P46063 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
KMO O15229 1/20 0.32
SLC22A12 Q96S37 1/20 0.32
F2 P00734 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4359176 0.80 POLB (0.39) POLBXDHKDM4EALDH1A1HPGD
SCHEMBL4360062 0.78 POLB (0.40) POLBPTGS2KDM4EALDH1A1KMO
SCHEMBL4356815 0.76 KMO (0.40) POLBKDM4EALDH1A1HTTSMN1; SMN2
SCHEMBL4360410 0.72 CDK2 (0.37) POLBPTGS1PTGS2KDM4EALDH1A1
SCHEMBL25291001 0.68 CDK2 (0.34) POLBKDM4EALDH1A1HPGDSMN1; SMN2
SCHEMBL11967314 0.68 MAPT (0.36) POLBKDM4EALDH1A1HPGDHTT
SCHEMBL55228 0.68 KDM4E (0.44) POLBXDHKDM4EALDH1A1HTT
SCHEMBL4358089 0.68 CDK2 (0.40) POLBPTGS1PTGS2KDM4EALDH1A1
SCHEMBL4362715 0.68 POLB (0.40) POLBPTGS2KDM4EALDH1A1HPGD
SCHEMBL4356034 0.68 POLB (0.40) POLBKDM4EALDH1A1HTTKMO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed