SCHEMBL436900

SCHEMBL436900

CC(Cl)OCCCl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25243423 1.00
SCHEMBL20774152 0.84
SCHEMBL8545537 0.84
SCHEMBL22401631 0.84
SCHEMBL2421973 0.84
SCHEMBL22401634 0.84
SCHEMBL8057836 0.83 ALDH1A1 (0.36)
SCHEMBL5045589 0.78
SCHEMBL5187333 0.78 ALDH1A1 (0.31)
SCHEMBL40453 0.78 LMNA (0.42)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11124888-B2 Copper deposition in wafer level packaging of integrated circuits MACDERMID ENTHONE INC. (US) 2021-09-21 US claimed
EP-3504186-A1 COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS MacDermid Enthone Inc. (US) 2019-07-03 EP claimed
WO-2018057590-A1 COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS MACDERMID ENTHONE INC. (US) 2018-03-29 WO claimed
US-8771495-B2 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers ENTHONE INC. (US) 2014-07-08 US claimed
US-20130241060-A1 METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS ENTHONE INC. (US) 2013-09-19 US claimed
US-8388824-B2 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers ENTHONE INC. (US) 2013-03-05 US claimed
EP-2358926-A2 ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS Enthone, Inc. (US) 2011-08-24 EP claimed
WO-2010062822-A2 ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS ENTHONE INC. (US) 2010-06-03 WO claimed
US-20100126872-A1 ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS ENTHONE, INC. (US) 2010-05-27 US claimed
EP-4739742-A1 LATENT CATALYST AND COATING COMPOSITIONS INCLUDING THE SAME SWIMC LLC (US) 2026-05-13 EP disclosed
WO-2025049313-A1 LATENT CATALYST AND COATING COMPOSITIONS INCLUDING THE SAME SWIMC LLC (US) 2025-03-06 WO disclosed
WO-2025042956-A1 PDE 7 MODULATOR COMPOUNDS OMEROS CORPORATION (US) 2025-02-27 WO disclosed
EP-4346815-A1 HETEROCYCLIC COMPOUNDS AND METHODS OF USE Schrödinger, Inc. (US) 2024-04-10 EP disclosed
EP-4195922-A1 SANITISING FORMULATION Lumendo AG (CH) 2023-06-21 EP disclosed
US-20030055297-A1 An alkyl, cycloalkyl, arylalkyl dihydroxy compound useful as intermediates; a cost-effective preparation ABBOTT LABORATORIES 2003-03-20 US disclosed
WO-2002081441-A1 PROCESS FOR THE PREPARATION OF SUBSTITUTED PYRROLIDINE NEURAMINIDASE INHIBITORS ABBOTT LABORATORIES (US) 2002-10-17 WO disclosed
EP-0676437-B1 USE OF POLYCATIONIC POLYMER AS BACTERICIDAL/ALGICIDAL AGENT SAGAMI CHEM RES (JP) 1999-09-08 EP disclosed
US-5616317-A HETEROCYCLIC NITROGEN POLYMER SAGAMI CHEMICAL RESEARCH CENTER (JP) 1997-04-01 US disclosed
EP-0676437-A1 POLYCATIONIC POLYMER AND POLYCATIONIC BACTERICIDAL/ALGICIDAL AGENT SAGAMI CHEMICAL RESEARCH CENTER (JP) 1995-10-11 EP disclosed
US-4108910-A EPOXIDE COMPOUND AND MONOETHER SOLVAY & CIE. (BE) 1978-08-22 US disclosed