SCHEMBL437703

SCHEMBL437703

C=Cc1ncncn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28213291 0.83 DPYD (0.32)
SCHEMBL8488701 0.76 ALDH1A1 (0.57)
SCHEMBL873896 0.75
SCHEMBL15054859 0.71 HDAC8 (0.35)
SCHEMBL36385 0.71
SCHEMBL28370696 0.69
SCHEMBL31107108 0.69
SCHEMBL6889110 0.69
SCHEMBL28667869 0.67 ALDH1A1 (0.40)
Hydrochloric Acid SCHEMBL28141632 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 571 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12606491-B2 Preceramic 3D-printing monomer and polymer formulations HRL LABORATORIES, LLC (US) 2026-04-21 US claimed
US-12503605-B2 Low-dielectric-tangent silica sol, and method for producing low-dielectric-tangent silica sol NISSAN CHEMICAL CORPORATION (JP) 2025-12-23 US claimed
WO-2025127152-A1 METAL OXIDE PARTICLES HAVING IMPROVED HYDROPHOBICITY, HIGHLY CONCENTRATED METAL OXIDE SOL, AND METHODS FOR PRODUCING SAME 日産化学株式会社 2025-06-19 WO claimed
WO-2025103355-A1 ANTI-EGFR AND -HER3 BISPECIFIC ANTIBODY-DRUG CONJUGATE AND USE THEREOF 信达生物制药(苏州)有限公司 2025-05-22 WO claimed
EP-4543872-A1 MULTI-PHOTOPROTECTIVE COMPOUNDS AND USES THEREOF SKINOSIVE (FR) 2025-04-30 EP claimed
CN-119736686-A Aluminum alloy plate for semiconductor equipment and preparation method thereof 江苏芯航东方科技有限公司 2025-04-01 CN claimed
CN-119409945-A Vinyl triazine porous organic polymer synthesized based on sonochemical method and preparation method and application thereof 武汉理工大学 2025-02-11 CN claimed
CN-119083172-A Heat-resistant carbon fiber and preparation method thereof 东莞市超强运动器材有限公司 2024-12-06 CN claimed
CN-118772792-B Preparation method of ultraviolet-resistant high-molecular self-adhesive waterproof coiled material 北新防水(安徽)有限公司 2024-11-19 CN claimed
CN-117730055-B Low dielectric loss tangent silica sol and method for producing low dielectric loss tangent silica sol 日产化学株式会社 2024-11-15 CN claimed
EP-1989146-A1 MOLECULARLY IMPRINTED POLYMER, PROCESS FOR PRODUCTION THEREOF AND PROCESS FOR THE SELECTIVE TREATMENT OF POORLY DEGRADABLE AND/OR TOXIC COMPOUNDS IN LIQUIDS Kist-Europe Forschungsgesellschaft Mbh (DE) 2008-11-12 EP claimed
EP-1954748-A2 PREPREGS AND CURED IN PLACE SOLID SURFACES PREPARED THEREFROM Ashland Licensing and Intellectual Property LLC (US) 2008-08-13 EP claimed
US-20070225443-A1 Prepregs and cured in place solid surfaces prepared therefrom ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC (US) 2007-09-27 US claimed
WO-2007096135-A1 MOLECULARLY IMPRINTED POLYMER, PROCESS FOR PRODUCTION THEREOF AND PROCESS FOR THE SELECTIVE TREATMENT OF POORLY DEGRADABLE AND/OR TOXIC COMPOUNDS IN LIQUIDS KIST-EUROPE FORSCHUNGSGESELLSCHAFT MBH (DE) 2007-08-30 WO claimed
WO-2007064688-A2 PREPREGS AND CURED IN PLACE SOLID SURFACES PREPARED THEREFROM ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC (US) 2007-06-07 WO claimed
US-6576334-B2 Bonding materials SONY CHEMICALS CORP. (JP) 2003-06-10 US claimed
US-20010021547-A1 Bonding materials SONY CHEMICALS CORP. 2001-09-13 US claimed
US-5741622-A COMPRISING COPOLYMER HAVING UNSATURATED COMPOUND AND FREE CARBOXYL GROUP, POLYFUNCTIONAL UNSATURATED COMPOND DILUENT, SOLVENT, PHOTOINITIATOR, VINYLTRIAZINE COMPOUND, INORGANIC FILLER TAIYO INK MANUFACTURING CO., LTD. (JP) 1998-04-21 US claimed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
EP-0747770-A2 One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof TAIYO INK MANUFACTURING CO. LTD. (JP) 1996-12-11 EP claimed