⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Isopropylamine SCHEMBL26643084 | 0.94 | — | — | |
| Isopropylamine SCHEMBL23295758 | 0.94 | — | — | |
| Isopropylamine SCHEMBL30440281 | 0.93 | — | — | |
| Isopropylamine SCHEMBL19813885 | 0.93 | — | — | |
| Isopropylamine SCHEMBL2909 | 0.93 | — | — | |
| Isopropylamine SCHEMBL7198176 | 0.86 | ALDH1A1 (0.42) | — | |
| Isopropylamine SCHEMBL11167187 | 0.86 | — | — | |
| Isopropylamine SCHEMBL20769333 | 0.86 | — | — | |
| Isopropylamine SCHEMBL635472 | 0.86 | — | — | |
| Isopropylamine SCHEMBL1579520 | 0.86 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20160087295-A1 | Catalyst and Process for the Production of Hydrogen from Ammonia Boranes | UNIVERSITY COLLEGE DUBLIN, NATIONAL UNIVERSITY OF IRELAND, DUBLIN (IE) | 2016-03-24 | — | — | US | claimed |
| EP-2988867-A2 | CATALYST AND PROCESS FOR THE PRODUCTION OF HYDROGEN FROM AMMONIA BORANES | Novaucd (IE) | 2016-03-02 | — | — | EP | claimed |
| WO-2014174465-A2 | PROCESS | NOVAUCD (IE) | 2014-10-30 | — | — | WO | claimed |
| US-20130209905-A1 | PROCESS FOR THE PRODUCTION OF HYDROGEN | NOVAUCD (IE) | 2013-08-15 | — | — | US | claimed |
| EP-2576432-A1 | PROCESS FRO THE PRODUCTION OF HYDROGEN | Novaucd (IE) | 2013-04-10 | — | — | EP | claimed |
| WO-2011151792-A1 | PROCESS FRO THE PRODUCTION OF HYDROGEN | NOVAUCD (IE) | 2011-12-08 | — | — | WO | claimed |
| US-7998859-B2 | Surface preparation process for damascene copper deposition | ENTHONE INC. (US) | 2011-08-16 | — | — | US | claimed |
| US-20100075496-A1 | SURFACE PREPARATION PROCESS FOR DAMASCENE COPPER DEPOSITION | ENTHONE INC. (US) | 2010-03-25 | — | — | US | claimed |
| US-6586563-B1 | Reacting diborane or borane complex with alkali carbonate; eliminates need for excess metals | MILLENNIUM CELL, INC. | 2003-07-01 | — | — | US | claimed |
| US-20030114632-A1 | PROCESSES FOR SYNTHESIZING ALKALI METAL BOROHYDRIDE COMPOUNDS | MILLENNIUM CELL, INC. | 2003-06-19 | — | — | US | claimed |
| US-5770032-A | SENITIZATION OF THE CLEANED SURFACE, ELECTROLESS AND ELECTROPLATING DEPOSITION, PHOTORESIST FORMATION, EXPOSURE, DEVELOPMENT AND PATTERNING | FIDELITY CHEMICAL PRODUCTS CORPORATION (US) | 1998-06-23 | — | — | US | claimed |
| EP-0331907-B1 | ELECTROLESS COPPER PLATING BATH | International Business Machines Corporation (US) | 1992-08-26 | — | — | EP | claimed |
| EP-0331907-A1 | Electroless copper plating bath | International Business Machines Corporation (US) | 1989-09-13 | — | — | EP | claimed |
| US-4818286-A | AMINE BORANE AND EDTA COMPOUNDS FOR FORMALDEHYDE FREE COPPER DEPOSITING | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1989-04-04 | — | — | US | claimed |
| CN-116804273-A | Electroless copper plating activating agent and preparation method thereof | 广东硕成科技股份有限公司 | 2023-09-26 | — | — | CN | disclosed |
| EP-3688063-A1 | IMPREGNATION RESIN MIXTURE | Hexion GmbH (DE) | 2020-08-05 | — | — | EP | disclosed |
| CN-111164126-A | Impregnating resin mixture | 瀚森有限责任公司 | 2020-05-15 | — | — | CN | disclosed |
| US-4138267-A | BORON HYDRIDE, HYDROXYALKYL ETHYLENEDIAMINE OR DIETHYLENETRIAMINE | OKUNO CHEMICAL INDUSTRY COMPANY, LIMITED (JP) | 1979-02-06 | — | — | US | disclosed |
| US-3962496-A | Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization | PHOTOCIRCUITS DIVISION OF KOLLMORGEN (US) | 1976-06-08 | — | — | US | disclosed |
| US-3959531-A | Improvements in electroless metal plating | PHOTOCIRCUITS CORPORATION (US) | 1976-05-25 | — | — | US | disclosed |