⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8931443 | 0.87 | — | — | |
| SCHEMBL1616074 | 0.87 | — | — | |
| SCHEMBL735758 | 0.87 | — | — | |
| SCHEMBL5865482 | 0.75 | — | — | |
| SCHEMBL11684102 | 0.75 | — | — | |
| SCHEMBL14694560 | 0.75 | — | — | |
| SCHEMBL9270463 | 0.75 | — | — | |
| SCHEMBL2838088 | 0.75 | — | — | |
| SCHEMBL1508941 | 0.75 | — | — | |
| SCHEMBL28628975 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-222638783-U | Flexible circuit board, flexible circuit board assembly and display device | 京东方科技集团股份有限公司 | 2025-03-18 | — | — | CN | disclosed |
| CN-117915546-A | Circuit board assembly and display device | 京东方科技集团股份有限公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-218830764-U | Circuit board assembly and display device | 京东方科技集团股份有限公司 | 2023-04-07 | — | — | CN | disclosed |
| CN-111230282-B | Micro-stirring friction welding process for electronic packaging | 哈尔滨工业大学 | 2021-10-19 | — | — | CN | disclosed |
| CN-111230282-A | Micro-stirring friction welding process for electronic packaging | 哈尔滨工业大学 | 2020-06-05 | — | — | CN | disclosed |
| US-10224707-B2 | Electronic component fuse and fused electronic component module | TAIYO YUDEN CO., LTD (JP) | 2019-03-05 | — | — | US | disclosed |
| US-20170317484-A1 | ELECTRONIC COMPONENT FUSE AND FUSED ELECTRONIC COMPONENT MODULE | TAIYO YUDEN CO., LTD. (JP) | 2017-11-02 | — | — | US | disclosed |
| US-20170294200-A1 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2017-10-12 | — | — | US | disclosed |
| US-9721599-B2 | Suspension board with circuit and producing method thereof | NITTO DENKO CORPORATION (JP) | 2017-08-01 | — | — | US | disclosed |
| US-20150380030-A1 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF | NITTO DENKO CORPORATION (JP) | 2015-12-31 | — | — | US | disclosed |
| US-20090233117-A1 | METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2009-09-17 | — | — | US | disclosed |
| US-20080268577-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | KAGII HIDEMASA | 2008-10-30 | — | — | US | disclosed |
| US-7405469-B2 | Semiconductor device and method of manufacturing the same | RENESAS TECHNOLOGY CORP. (JP) | 2008-07-29 | — | — | US | disclosed |
| EP-1946626-A1 | METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT | Matsushita Electric Industrial Co., Ltd. (JP) | 2008-07-23 | — | — | EP | disclosed |
| US-20070210430-A1 | Semiconductor device and method of manufacturing the same | RENESAS ELECTRONICS CORPORATION (JP) | 2007-09-13 | — | — | US | disclosed |
| US-7256501-B2 | Semiconductor device and manufacturing method of the same | RENESAS TECHNOLOGY CORP. (JP) | 2007-08-14 | — | — | US | disclosed |
| US-7220617-B2 | Semiconductor device and method of manufacturing the same | RENESAS TECHNOLOGY, CORP. (JP) | 2007-05-22 | — | — | US | disclosed |
| WO-2007055410-A1 | METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-05-18 | — | — | WO | disclosed |
| US-20060175700-A1 | Semiconductor device and method of manufacturing the same | RENESAS ELECTRONICS CORPORATION (JP) | 2006-08-10 | — | — | US | disclosed |
| US-20060138532-A1 | Semiconductor device and manufacturing method of the same | RENESAS ELECTRONICS CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |