⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3720682 | 0.87 | — | — | |
| SCHEMBL25217448 | 0.87 | — | — | |
| SCHEMBL735758 | 0.87 | — | — | |
| SCHEMBL4800153 | 0.87 | — | — | |
| SCHEMBL4385133 | 0.75 | — | — | |
| SCHEMBL890969 | 0.75 | — | — | |
| Arsenic SCHEMBL18787883 | 0.75 | — | — | |
| SCHEMBL10424510 | 0.75 | — | — | |
| SCHEMBL23926946 | 0.75 | — | — | |
| SCHEMBL9270463 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7141273-B2 | Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | claimed |
| US-20050084691-A1 | Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-21 | — | — | US | claimed |
| WO-2026105522-A1 | THERMALLY CONDUCTIVE CURABLE SILICONE COMPOSITION AND METHOD FOR CURING SAME | 信越化学工業株式会社 | 2026-05-21 | — | — | WO | disclosed |
| WO-2026100290-A1 | HEAT-SOFTENABLE THERMALLY CONDUCTIVE SILICONE COMPOSITION AND HEAT-SOFTENABLE THERMALLY CONDUCTIVE CURED SILICONE PRODUCT | 信越化学工業株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-20260136980-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-05-14 | — | — | US | disclosed |
| EP-4664519-A1 | THERMALLY CONDUCTIVE COMPOSITION | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4606862-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-08-27 | — | — | EP | disclosed |
| US-20250223441-A1 | THERMAL CONDUCTIVE SILICONE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-07-10 | — | — | US | disclosed |
| CN-120051535-A | Curable organopolysiloxane composition and semiconductor device | 信越化学工业株式会社 | 2025-05-27 | — | — | CN | disclosed |
| US-20250115784-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND PRODUCTION METHOD THEREFOR | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-04-10 | — | — | US | disclosed |
| CN-119753533-A | Aluminum alloy composite material for vehicle and preparation method and application thereof | 株洲宜安精密制造有限公司 | 2025-04-04 | — | — | CN | disclosed |
| WO-2022230600-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2022-11-03 | — | — | WO | disclosed |
| CN-113228262-A | Thermally conductive silicone composition and semiconductor device | 信越化学工业株式会社 | 2021-08-06 | — | — | CN | disclosed |
| WO-2020129555-A1 | HEAT-CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE | 信越化学工業株式会社 | 2020-06-25 | — | — | WO | disclosed |
| CN-110972409-A | Component assembling method and device | 北京梦之墨科技有限公司 | 2020-04-07 | — | — | CN | disclosed |
| CN-209767962-U | Component assembling device | BEIJING DREAM INK TECH CO LTD | 2019-12-10 | — | — | CN | disclosed |
| US-8802763-B2 | Curable organopolysiloxane composition and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-08-12 | — | — | US | disclosed |
| US-20130087905-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-11 | — | — | US | disclosed |
| US-7141273-B2 | Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20050084691-A1 | Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-04-21 | — | — | US | disclosed |