⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4385133 | 0.87 | — | — | |
| SCHEMBL1508941 | 0.87 | — | — | |
| SCHEMBL5865482 | 0.87 | — | — | |
| SCHEMBL9270463 | 0.87 | — | — | |
| SCHEMBL5145518 | 0.82 | — | — | |
| SCHEMBL8829641 | 0.82 | — | — | |
| SCHEMBL636148 | 0.82 | — | — | |
| SCHEMBL1616070 | 0.82 | — | — | |
| SCHEMBL8731245 | 0.82 | — | — | |
| SCHEMBL4697257 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 841 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122060439-A | Carbon-based tile back adhesive and preparation method thereof | 贵州诺斯德建筑材料有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-116676506-B | Indium tin bismuth metal-based heat camouflage material and preparation method thereof | 南京林业大学 | 2026-05-15 | — | — | CN | claimed |
| CN-122025733-A | Battery monomer and preparation method thereof, battery device, power utilization device and energy storage device | 浙江晶科储能有限公司 | 2026-05-12 | — | — | CN | claimed |
| EP-4382226-B1 | METHOD OF MAKING A TOOL COMPRISING EUTECTIC MATERIAL | BOEING CO (US) | 2026-03-25 | — | — | EP | claimed |
| EP-4591402-B1 | HIGH-VELOCITY AIR-FUEL COATINGS FOR CONDUCTOR CORROSION RESISTANCE | CATERPILLAR INC (US) | 2026-03-25 | — | — | EP | claimed |
| US-20250379006-A1 | THERMAL MANAGEMENT DEVICE AND A CIRCUIT INTERRUPTER HAVING THE SAME | EATON INTELLIGENT POWER LIMITED (IE) | 2025-12-11 | — | — | US | claimed |
| US-12431260-B2 | High-velocity air-fuel coatings for conductor corrosion resistance | CATERPILLAR INC. (US) | 2025-09-30 | — | — | US | claimed |
| CN-120194176-A | Low-melting-point metal microfluidic valve and microfluidic device comprising same | 佳能医疗系统株式会社 | 2025-06-24 | — | — | CN | claimed |
| CN-120199755-A | Test structure for flip chip packaging and preparation method thereof | 中国科学院上海微系统与信息技术研究所 | 2025-06-24 | — | — | CN | claimed |
| US-20250176110-A1 | AIR-PERMEABLE STRETCHABLE CIRCUIT WHICH CAN BE ACTIVATED BY STAMPING, PREPARATION METHOD AND USE THEREOF | SOOCHOW UNIVERSITY (CN) | 2025-05-29 | — | — | US | claimed |
| EP-1596894-A1 | COMPOSITE MEDICAL DEVICE | Boston Scientific Limited (BB) | 2005-11-23 | — | — | EP | claimed |
| US-20050139844-A1 | Organic electroluminescent device and method of fabricating the same | LG. PHILIPS LCD CO., LTD. | 2005-06-30 | — | — | US | claimed |
| US-6843199-B2 | Heat-sensitive odor-emitting component | HITACHI CABLE, LTD. (JP) | 2005-01-18 | — | — | US | claimed |
| US-6813153-B2 | INDIUM TIN BISMUTH ALLOY WITH GOLD FILLER; DIFFUSING TO FORM HIGH MELTING, ROBUST THERMAL INTERFACE MATERIAL | INTEL CORPORATION | 2004-11-02 | — | — | US | claimed |
| WO-2004075941-A1 | COMPOSITE MEDICAL DEVICE | BOSTON SCIENTIFIC LIMITED (BB) | 2004-09-10 | — | — | WO | claimed |
| US-20040167441-A1 | Composite medical device | BOSTON SCIENTIFIC SCIMED, INC. | 2004-08-26 | — | — | US | claimed |
| US-20040052050-A1 | Polymer solder hybrid | INTEL CORPORATION | 2004-03-18 | — | — | US | claimed |
| US-20040049983-A1 | Heat-sensitive odor-emitting component | HITACHI CABLE, LTD. | 2004-03-18 | — | — | US | claimed |
| US-20030189260-A1 | FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF | ADVANCED SEMICONDUCTOR ENGINEERING, INC. (TW) | 2003-10-09 | — | — | US | claimed |
| US-5476726-A | Good bonding even after many repairs | HITACHI, LTD. (JP) | 1995-12-19 | — | — | US | claimed |