Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APEX1 | P27695 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | HMGCR | P04035 | 1/20 | 0.32 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.32 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.32 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4388580 | 0.73 | LMNA (0.31) | ALDH1A1 | |
| SCHEMBL443221 | 0.65 | — | — | |
| SCHEMBL6525074 | 0.65 | SMN1; SMN2 (0.30) | — | |
| SCHEMBL4184455 | 0.64 | APEX1 (0.47) | APEX1ALDH1A1TSHR | |
| SCHEMBL5824335 | 0.64 | — | — | |
| SCHEMBL29042185 | 0.61 | LMNA (0.33) | — | |
| SCHEMBL109468 | 0.61 | LMNA (0.33) | — | |
| SCHEMBL4188327 | 0.61 | APEX1 (0.70) | APEX1ALDH1A1 | |
| SCHEMBL27889745 | 0.60 | JAK2 (0.38) | APEX1ALDH1A1 | |
| SCHEMBL1833220 | 0.60 | LMNA (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7560372-B2 | Process for making a semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2009-07-14 | — | — | US | disclosed |
| US-7268087-B2 | Manufacturing method of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2007-09-11 | — | — | US | disclosed |
| US-7170172-B2 | Semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2007-01-30 | — | — | US | disclosed |
| US-20070015351-A1 | Process or making a semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2007-01-18 | — | — | US | disclosed |
| US-6992050-B2 | Stripping agent composition and method of stripping | NEC CORPORATION (JP) | 2006-01-31 | — | — | US | disclosed |
| US-20040266171-A1 | Manufacturing method of semiconductor device | NEC ELECTRONICS CORPORATION | 2004-12-30 | — | — | US | disclosed |
| US-6787480-B2 | Manufacturing method of semicondcutor device | NEC CORPORATION (JP) | 2004-09-07 | — | — | US | disclosed |
| US-20040029051-A1 | Stripping agent composition and method of stripping | NEC CORPORATION (JP) | 2004-02-12 | — | — | US | disclosed |
| US-20030111731-A1 | Semiconductor device and method for producing the same | NEC ELECTRONICS CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20020155702-A1 | Manufacturing method of semiconductor device | NEC CORPORATION | 2002-10-24 | — | — | US | disclosed |