⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6522552 | 0.76 | — | — | |
| SCHEMBL27524563 | 0.72 | CSNK2A2 (0.37) | — | |
| SCHEMBL6522896 | 0.72 | PKM (0.32) | — | |
| SCHEMBL6520898 | 0.68 | CYP1A2 (0.31) | — | |
| SCHEMBL11757540 | 0.67 | LMNA (0.30) | — | |
| SCHEMBL29172397 | 0.64 | — | — | |
| SCHEMBL9052845 | 0.64 | POLB (0.35) | — | |
| SCHEMBL6526383 | 0.64 | CSNK2A2 (0.37) | — | |
| SCHEMBL28512835 | 0.64 | APEX1 (0.39) | — | |
| SCHEMBL27889745 | 0.62 | JAK2 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7560372-B2 | Process for making a semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2009-07-14 | — | — | US | disclosed |
| US-7268087-B2 | Manufacturing method of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2007-09-11 | — | — | US | disclosed |
| US-7170172-B2 | Semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2007-01-30 | — | — | US | disclosed |
| US-20070015351-A1 | Process or making a semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2007-01-18 | — | — | US | disclosed |
| US-6992050-B2 | Stripping agent composition and method of stripping | NEC CORPORATION (JP) | 2006-01-31 | — | — | US | disclosed |
| US-20040266171-A1 | Manufacturing method of semiconductor device | NEC ELECTRONICS CORPORATION | 2004-12-30 | — | — | US | disclosed |
| US-6787480-B2 | Manufacturing method of semicondcutor device | NEC CORPORATION (JP) | 2004-09-07 | — | — | US | disclosed |
| US-20040029051-A1 | Stripping agent composition and method of stripping | NEC CORPORATION (JP) | 2004-02-12 | — | — | US | disclosed |
| US-20030111731-A1 | Semiconductor device and method for producing the same | NEC ELECTRONICS CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20020155702-A1 | Manufacturing method of semiconductor device | NEC CORPORATION | 2002-10-24 | — | — | US | disclosed |